Method of manufacturing multilayer wiring substrate
In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed.
1. A method of manufacturing a multilayer wiring substrate having a laminate structure in which a plurality of resin insulation layers, and a plurality of conductive layers are laminated alternately in multilayer arrangement, a plurality of first-main-surface-side connection terminals being disposed on one side of the laminate structure where a first main surface thereof is present, a plurality of second-main-surface-side connection terminals being disposed on an other side of the laminate structure where a second main surface thereof is present, the plurality of conductive layers being formed in the plurality of resin insulation layers and interconnected by means of via conductors whose diameters increase toward the first main surface or the second main surface, the method comprising:
a build-up step that includes:
a step of separably laminating a metal foil on a side of a base material, and
a step of forming a laminate structure that includes alternately laminating the plurality of resin insulation layers made primarily of the same resin insulation material and the plurality of conductive layers in multilayer arrangement on the metal foil separably laminated on the side of the base material;
a drilling step of forming a plurality of openings in an outermost resin insulation layer of the laminate structure through laser drilling so as to expose the first-main-surface-side connection terminals of the multilayer wiring substrate;
a desmear step of, after the drilling step, removing smears from inside the openings in the outermost resin insulation layer of the laminate structure; and
a base-material removing step of, after the build-up step, removing the base material and exposing the metal foil.
2. The method of manufacturing a multilayer wiring substrate according to claim 1 , wherein the outermost resin insulation layer is formed of a build-up material mainly formed of a hardened resin insulation material that is not photocurable.
3. The method of manufacturing a multilayer wiring substrate according to claim 1 , wherein the drilling step is performed before the base-material removing step, further comprising:
a connection-terminal forming step of, after the base-material removing step, forming the second-main-surface-side connection terminals in a state in which etching resist films cover an entirety of the first main surface and the metal foil in a predetermined pattern corresponding to the second-main-surface-side connection terminals, and subsequently etching the metal foil to form the second-main-surface-side connection terminals; and
a resist removing step of removing the etching resist films to thereby expose the first-main-surface-side connection terminals and the second-main-surface-side connection terminals.
4. The method of manufacturing a multilayer wiring substrate according to claim 1 , further comprising:
a connection-terminal forming step of, after the base-material removing step, forming the second-main-surface-side connection terminals by patterning the metal foil by a subtractive method in a state in which an etching resist film is provided on the second main surface;
wherein the drilling step is performed after the connection-terminal forming step.
5. The method of manufacturing a multilayer wiring substrate according to claim 1 , wherein the drilling step exposes the first-main-surface-side connection terminals and a portion of one of the plurality of conductive layers other than the first-main-surface-side connection terminals.
6. The method of manufacturing a multilayer wiring substrate according to claim 1 , wherein the base-material removing step is performed after the drilling step and after the desmear step.