Semiconductor laser device, optical pickup device and semiconductor device
A semiconductor laser device includes a Si(100) substrate in which a recess having an opening and a bottom face surrounded by inner wall surfaces is formed, a semiconductor laser element placed on the bottom face, and a translucent sealing glass, mounted on top of the Si(100) substrate, which seals the opening. The laser light emitted from the semiconductor laser element is reflected by a metallic reflective film formed on the inner wall surface and then transmits through the sealing glass so as to be emitted externally.
1. A semiconductor device, comprising:
an insulating resin layer;
a wiring layer disposed on one main surface of said insulating resin layer;
a bump protruding on a side of said insulating resin layer, the bump being formed integrally with said wiring layer;
a semiconductor element in which an element electrode electrically connected to said bump is formed;
a support member having an opening formed such that at least said semiconductor element is exposed, said support member disposed on the other main surface of said insulating resin layer; and
a sealing member provided on said support member in such a manner as to block the opening,
wherein a space is provided between an inner wall of the support member and a side surface of the semiconductor element, and a space in the opening in which the semiconductor element is placed is air-tightly sealed by the sealing member,
wherein said semiconductor device is a laser element, and said sealing member has translucency,
wherein a laser light emitted from the laser element is reflected by inner wall surface of said support member or a film provided on the inner wall surface and transmits through said sealing member.
2. The semiconductor device according to claim 1 , wherein said semiconductor element is provided on top of said bump.
3. The semiconductor device according to claim 1 , wherein at least a part of top surface of said bump overlaps with an underside of said support member near the opening.
4. The semiconductor device according to claim 2 , wherein at least a part of top surface of said bump overlaps with an underside of said support member near the opening.
5. The semiconductor device according to claim 1 , wherein said support member has an inner wall surface which is tilted relative to the main surface of said insulating resin layer.
6. The semiconductor device according to claim 2 , wherein said support member has an inner wall surface which is tilted relative to the main surface of said insulating resin layer.
7. The semiconductor device according to claim 2 , wherein said semiconductor device is a laser element, and said sealing member has translucency.
8. The semiconductor device according to claim 7 , wherein a laser light emitted from the laser element is reflected by inner wall surface of said support member or a film provided on the inner wall surface and transmits through said sealing member.
9. The semiconductor device according to claim 1 , wherein the support member and the sealing member are separate members.
10. A semiconductor device, comprising:
an insulating resin layer;
a wiring layer disposed on one main surface of said insulating resin layer;
a bump protruding on a side of said insulating resin layer, the bump being formed integrally with said wiring layer;
a semiconductor element in which an element electrode electrically connected to said bump is formed;
a support member having an opening formed such that at least said semiconductor element is exposed, said support member disposed on the other main surface of said insulating resin layer; and
a sealing member provided on said support member in such a manner as to block the opening,
wherein the an underside of the semiconductor element is in contact with a top surface of the bump,
wherein said semiconductor device is a laser element, and said sealing member has translucency,
wherein a laser light emitted from the laser element is reflected by inner wall surface of said support member or a film provided on the inner wall surface and transmits through said sealing member.