Method and system of embedded microlens

1. An image sensor device comprising:

an array of photo sensing portions formed in a semiconductor substrate;

a first dielectric layer overlying the array of photo-sensors, the first dielectric layer having a first index of refraction and including a surface;

an array of microlenses embedded in-the first dielectric layer, each of the microlenses being center-aligned over one of the array of photo sensing portions and having a truncated plano-convex shape, the microlenses being formed from a second dielectric material having a second index of refraction; and

a color filter layer overlying the array of microlenses;

wherein the truncated plano-convex shape includes a circular top having a smoothtop surface, a flat circular bottom, and a curved circumferential side convex towards the semiconductor substrate.

2. The image sensor device of claim 1 further comprising a plurality of charge transfer circuits formed in the semiconductor substrate, each of the charge transfer circuits being coupled to each of the array of photo sensors.

3. The image sensor device of claim 1 , wherein each of the array of photo-sensors comprises a CCD camera pixel, a photodiode, or an RGB color sensor element.

4. The image sensor device of claim 1 , wherein the semiconductor substrate comprises a back-end-of-line processed silicon wafer, an SOI substrate, a quartz substrate, a ceramic substrate, or a glass substrate.

5. The image sensor device of claim 1 , wherein the first dielectric layer comprises silicon dioxide or polyimide with index of refraction equal to or slightly less than 1.5.

6. The image sensor device of claim 1 , wherein the first dielectric layer comprises a thickness capable of forming embedded microlenses having a predetermined focal length.

7. The image sensor device of claim 1 , wherein the second dielectric material is selected from the group consisting of silicon nitride, titanium oxide, zirconium oxide, hafnium oxide, and zinc oxide.

8. The image sensor device of claim 1 , wherein the second dielectric material comprises an index of refraction about 2.0 or higher.

9. The image sensor device of claim 1 , wherein the circular top comprises a diameter that is equal to or slightly less than a distance between the center of any two adjacent microlenses.

10. The image sensor device of claim 1 , wherein the circular top of each of the microlenses is co-planar with the surface of the first dielectric layer.

11. The image sensor device of claim 1 , wherein the flat circular bottom comprises a diameter that is about ¼ to ½ of the circular top's diameter.

12. The image sensor device of claim 1 , wherein the circular bottom is separated from the array of photo sensing portions by the first dielectric layer.

13. The image sensor device of claim 1 , wherein the color filter layer comprises a negative photoresist based on an acrylic polymer including color pigments.

14. The image sensor device of claim 13 , wherein the color pigments comprise red, green, blue (RGB) or cyan, magenta, and yellow (CMY) dyed polymers.

15. The image sensor device of claim 1 , wherein the color filter layer comprises an index of refraction smaller than the second index of refraction.

16. The image sensor device of claim 1 further comprising an anti-reflection coating interposed between the microlenses and the color filter layer.

17. The image sensor device of claim 1 , wherein the first dielectric layer comprises a multi-layer film having a variable refractive index.

18. The image sensor device of claim 17 , wherein the first dielectric layer comprises a material containing nitrogen ions or metal particles.

19. The image sensor device of claim 1 , wherein the first index of refraction is lower than the second index of refraction.

20. The image sensor device of claim 1 , wherein the color filter layer has a thickness in a range from 0.7 to 1.5 microns.