POLISHING PAD WITH ENDPOINT WINDOW AND SYSTEMS AND METHODS USING THE SAME
A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate. The guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer. The polishing pad includes an optical path along the first direction and through a thickness of the pad.
1 . A polishing pad comprising a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate, wherein the guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer, wherein the polishing pad comprises an optical path along the first direction and through a thickness of the pad for transmitting a signal for in situ monitoring of an endpoint in a polishing operation.
2 . The polishing pad of claim 1 , wherein the optical path comprises a first region in the polishing composition distribution layer free of polishing elements and a transparent region in the support layer, wherein the transparent region is substantially aligned along the first direction with the first region.
3 . The polishing pad of claim 2 , wherein the transparent region comprises an aperture in the support layer.
4 . The polishing pad of claim 3 , wherein the polishing composition distribution layer comprises an aperture overlying the aperture in the support layer.
5 . The polishing pad of claim 3 , further comprising a transparent member in the aperture in the support layer, wherein the transparent member is adjacent to the second side of the guide plate.
6 . The polishing pad of claim 5 , further comprising a layer of adhesive between the transparent member and a major surface of the guide plate.
7 . The polishing pad of claim 3 , further comprising an adhesive on at least a portion of an exposed wall of the aperture in the support layer.
8 . The polishing pad of claim 3 , further comprising an adhesive at an interface between the support layer and the guide plate.
9 . The polishing pad of claim 1 , wherein the guide plate is transparent.
10 . The polishing pad of claim 2 , wherein the transparent region in the support layer comprises a transparent polymer.
11 . The polishing pad of claim 2 , wherein the entire support layer comprises a transparent polymer.
12 . The polishing pad of claim 1 , wherein the guide plate comprises a transparent polymer.
13 . The polishing pad of claim 1 , wherein the polishing elements comprise elongate cylinders, and wherein a longitudinal axis of the cylinders is along the first direction.
14 . The polishing pad of claim 13 , wherein the polishing elements comprise a flange, and wherein the flange engages the guide plate.
15 . The polishing pad of claim 1 , wherein the polishing elements have a hollow body.
16 . The polishing pad of claim 1 , wherein the guide plate comprises an array of apertures, and wherein at least a portion of the apertures comprise a main bore and an undercut region, and wherein the undercut region forms a shoulder that retains a flange on a polishing element.
17 . A polishing pad comprising
a polishing composition distribution layer comprising a plurality of polishing elements, wherein the polishing elements extend upwardly through the polishing composition distribution layer, and wherein the polishing composition distribution layer comprises a first region comprising at least one transparent polishing element; and
a support layer comprising a transparent region underlying the first region.
18 . The polishing pad of claim 17 , wherein the guide plate is transparent.
19 . The polishing pad of claim 17 , wherein the transparent region in the support layer comprises a transparent polymer.
20 . The polishing pad of claim 17 , wherein the entire support layer comprises a transparent polymer.
21 . A chemical mechanical polishing system, comprising:
a platen;
the polishing pad of claim 17 on the platen; and
a monitoring system to monitor a polishing operation, wherein the monitoring system emits a monitoring signal to a detector through the first region and the transparent region.
22 . A method comprising polishing a workpiece with the polishing pads of claim 1 or 17 .