Resin overcap provided with IC tag
[Problem] To provide a resin overcap provided with an IC tag that can be used as an overcap being fitted onto a metal cap and having an IC tag that is so provided that the transmission and reception of signals will not be disturbed by the metal cap. [Means for Solution] A resin overcap used being fitted onto a metal cap, comprising a top panel and a cylindrical side wall hanging down from the circumferential edge of the top panel and in which the metal cap is fitted, wherein a step or a protrusion is formed on an upper portion on the inner surface of the cylindrical side wall to prevent the upward motion of the metal cap fitted in the cylindrical side wall, and an IC tag provided with an IC chip is mounted on the top panel in a manner of maintaining a predetermined distance D to a top plate of the metal cap fitted into the cylindrical side wall.
1. A resin overcap used being fitted onto a metal cap, comprising:
a top panel and a cylindrical side wall hanging down from a circumferential edge of the top panel and in which the metal cap is fitted;
wherein a step or a protrusion is formed on an upper portion on an inner surface of said cylindrical side wall to prevent an upward motion of the metal cap fitted in said cylindrical side wall; and
an IC tag provided with an IC chip is mounted on said top panel in a manner of maintaining a predetermined distance D to a top plate of the metal cap fitted into said cylindrical side wall.
2. The resin overcap according to claim 1 , wherein a knurling is formed on the inner surface of said cylindrical side wall at a position under said step.
3. The resin overcap according to claim 1 , wherein an engaging protrusion is formed on the inner surface of said cylindrical side wall so as to engage with an outer surface of a skirt of the metal cap.
4. The resin overcap according to claim 1 , wherein said IC tag is so mounted on the top panel that the distance D is not less than 2 mm with respect to the top plate of the metal cap.