Element array, electromechanical conversion device, and process for producing the same

1. An element array comprising:

a plurality of elements, each of said elements having:

a first electrode,

a second electrode, and

a support disposed on said first electrode so as to interpose a gap between said first electrode and said second electrode, wherein said first electrodes are separated by grooves, and

an insulating connection substrate said first electrodes being bonded to a first side of said connection substrate, and said connection substrate being provided with a wiring disposed from each of said first electrodes through said connection substrate to the side of said connection substrate opposite to said first electrodes.

2. The element array according to claim 1 , wherein said connection substrate has through-holes for said wiring.

3. The element array according to claim 2 , wherein said first electrodes are formed one-to-one for said through-holes.

4. The element array according to claim 1 , wherein said wiring and said first electrode are not coaxial.

5. The element array according to claim 1 , wherein said grooves are shut by said connection substrate where said first electrodes and said connection substrate are bonded together.

6. The element array according to claim 2 , wherein said through-holes expand from said first face of said connection substrate toward said opposite face.

7. The element array according to claim 1 , further comprising an element substrate, said elements being arrayed on said element substrate, and wherein said connection substrate has a relative permittivity ranging from 3.8 to 10, a Young's modulus of not lower than 5 GPa, and a thermal expansion coefficient of not more than three times that of said element substrate.

8. The element array according to claim 1 , wherein said first electrode is formed from a semiconductor material.

9. The element array according to claim 1 , wherein said first electrode and said connection substrate are bonded by any of melt bonding, pressure bonding, anode bonding, direct bonding, and diffusion bonding.

10. The element array according to claim 1 , further comprising:

a membrane supported by said support,

and wherein said second electrode is disposed on said support.

11. The element array according to claim 10 , wherein said support and said membrane are disposed on said first electrode and said groove.

12. The element array according to claim 1 , wherein said connection substrate has a thickness that is in a range from 50 μm to 1000 μm.

13. A process for producing an electromechanical conversion device which has a circuit substrate and an element substrate having a plurality of elements, each element having a first electrode, a second electrode, and a support disposed on the first electrode so as to interpose a gap between the first electrode and the second electrode, comprising:

bonding the element substrate and an insulating connection substrate;

forming grooves for separating the first electrodes for each of the elements on the element substrate bonded to the connection substrate; and

fixing the connection substrate and the circuit substrate together by providing wirings that extend from each of the first electrodes, through the connection substrate, to a surface of the connection substrate which is opposite to the surface where the first electrodes are provided.

14. The process for producing an electromechanical conversion device according to claim 13 , further comprising forming, in the connection substrate, through-holes for forming the wiring.

15. The process for producing an electromechanical conversion device according to claim 13 , wherein, in formation of the grooves, the grooves are formed so as not to penetrate the first electrode before bonding the connection substrate to the element substrate, and portions of the grooves remaining are removed after bonding of the connection substrate to the element electrode.