Anisotropic conductive adhesive
An anisotropic conductive adhesive includes an epoxy adhesive containing an epoxy compound and a curing agent and conducive particles dispersed in the epoxy adhesive. When elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM 35 , EM 55 , EM 95 , and EM 150 , respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM 55-95 and ΔEM 95-150 , respectively, the following expressions (1) to (5) are satisfied. 700Mpa≦EM 35 ≦3000MPa (1) EM 150 <EM 95 <EM 55 <EM 35 (2) ΔEM 55-95 <ΔEM 95-150 (3) 20% ≦ΔEM 55-95 (4) 40% ≦ΔEM 95-150 (5)
1. An anisotropic conductive adhesive comprising an epoxy adhesive containing an acrylic resin obtained by copolymerizing 10 to 100 parts by mass of glycidyl methacrylate or diethylaminoethyl acrylate based on 100 parts by mass of ethyl acrylate, an epoxy compound and an alicyclic acid anhydride curing agent as a curing agent, and conducive particles dispersed in the epoxy adhesive, the acrylic resin having a weight average molecular weight of 5000 to 200000 and a glass transition temperature of 50° C. or less, wherein when elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM 35 , EM 55 , EM 95 , and EM 150 , respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM 55-95 and ΔEM 95-150 , respectively, the following expressions (1) to (5) are satisfied
700Mpa≦EM 35 ≦3000MPa (1)
EM 150 <EM 95 <EM 55 <EM 35 (2)
ΔEM 55-95 <ΔEM 95-150 (3)
20% <ΔEM 55-95 (4)
40% <ΔEM 95-150 (5).
2. The anisotropic conductive adhesive according to claim 1 , wherein the change rates in the elastic modulus ΔE M 55-95 and ΔEM 95-150 satisfy the following expressions (4′) and (5′), respectively.
20% <ΔEM 55-95 <35% 4′
40% <ΔEM 95-150 <70% 5′
3. The anisotropic conductive adhesive according to claim 1 , wherein the epoxy adhesive contains 80 to 120 parts by mass of the curing agent based on 100 parts by mass of the epoxy compound.
4. The anisotropic conductive adhesive according to claim 1 , wherein a used amount of the acrylic resin in the epoxy adhesive is 10 to 50 parts by mass based on a total of 100 parts by mass of the epoxy compound, the curing agent, and the acrylic resin.
5. The anisotropic conductive adhesive according to claim 1 , wherein the epoxy compound is an alicyclic epoxy compound.
6. The anisotropic conductive adhesive according to claim 5 , wherein the alicyclic epoxy compound is a hydrogenated product of glycidyl bisphenol A or 3,4-epoxycyclohexenylmethyl-3′,4′-epoxycyclohexene carboxylate, and the alicyclic acid anhydride curing agent is methylhexahydrophthalic anhydride.
7. The anisotropic conductive adhesive according to claim 1 , wherein 2-methyl-4-ethyl imidazole is contained as a curing accelerator in an amount of 0.01 to 10 parts by mass based on 100 parts by mass of the curing agent.
8. A connection structure formed by flip-chip mounting a chip part on a circuit substrate using the anisotropic conductive adhesive according to claim 1 .
9. The connection structure according to claim 8 , wherein the chip part is an LED element.
10. An anisotropic conductive adhesive comprising an epoxy adhesive containing an acrylic resin obtained by copolymerizing 10 to 100 parts by mass of glycidyl methacrylate or diethylaminoethyl acrylate based on 100 parts by mass of ethyl acrylate, an epoxy compound and an alicyclic acid anhydride curing agent as a curing agent, and conducive particles dispersed in the epoxy adhesive, the acrylic resin having a weight average molecular weight of 5000 to 200000 and a glass transition temperature of 50° C. or less, wherein
when elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM 35 , EM 55 , EM 95 , and EM 150 ° , respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM 55-95 and ΔEM 95-150 ° , respectively, the following expressions (1) to (5) are satisfied:
700Mpa≦EM 35 ≦3000MPa (1)
EM 150 <EM 95 <EM 55 <EM 35 (2)
ΔEM 55-95 and ΔEM 95-150 (3)
20% <ΔEM 55-95 (4)
40% <ΔEM 95-150 (5),
and wherein: the epoxy adhesive contains 80 to 120 parts by mass of the curing agent based on 100 parts by mass of the epoxy compound; a used amount of the acrylic resin in the epoxy adhesive is 10 to 50 parts by mass based an a total of 100 parts by mass of the epoxy compound, the curing agent, and the acrylic resin; and 2-methyl-4-ethyl imidazole is contained as a curing accelerator in an amount of 0.01 to 10 parts by mass based on 100 parts by mass of the curing agent.
11. An anisotropic conductive adhesive comprising an epoxy adhesive containing an acrylic resin obtained by copolymerizing 10 to 100 parts by mass of diethylaminoethyl acrylate based on 100 parts by mass of ethyl acrylate, an epoxy compound and a curing agent, and conducive particles dispersed in the epoxy adhesive, the acrylic resin having a weight average molecular weight of 5000 to 200000 and a glass transition temperature of 50° C. or less, wherein when elastic moduluses at 35° C., 55° C., 95° C., and 150° C. of a cured product of the anisotropic conductive adhesive are denoted by EM 35 , EM 55 , EM 95 , and EM 150 , respectively, and change rates in the elastic modulus between 55° C. and 95° C. and between 95° C. and 150° C. are denoted by ΔEM 55-95 and ΔEM 95-150 , respectively, the following expressions (1) to (5) are satisfied
700Mpa≦EM 35 ≦3000MPa (1)
EM 150 <EM 95 <EM 55 <EM 35 (2)
ΔEM 55-95 <ΔEM 95-150 (3)
20% <ΔEM 55-95 (4)
40% <ΔEM 95-150 (5).