IP Library Granted Patent US 8,876,453
Granted Patent B2
US 8,876,453 · App. 13/004,495 · Granted Nov 4, 2014

Substrate processing apparatus and method of manufacturing semiconductor device

Inventors: Yukinori Aburatani (Toyama, JP); Masakazu Shimada (Toyama, JP); Osamu Morita (Toyama, JP)
Assignee: Hitachi Kokusai Electric Inc.
H01L21/67109
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Quick Facts
Patent No.
US 8,876,453
App. No.
13/004,495
Granted
Nov 4, 2014
Kind
B2
Abstract

A substrate processing apparatus suppresses vibration of a cover when unloading a boat from a process pipe. The apparatus comprises a boat for placing a substrate, a process pipe configured to accommodate the boat, a cover having the boat placed thereon, the cover configured to open and close a furnace port installed on a lower end of the process pipe, a motor to drive an elevation mechanism which moves the cover upward and downward, a sealing member to seal a space between the cover and the process pipe, and a controller to control motor speed and limit motor torque while the cover moves from the furnace port to a predetermined position. The substrate is maintained at a rest position in the boat during a recovery from a deformation of the cover occurring when separating the sealing member from the cover surface or the process pipe surface.

Claims (17)

1. A substrate processing apparatus comprising:

a boat accommodating a substrate;

a process pipe configured to accommodate the boat;

a cover disposed below the boat and configured to open and close a furnace port disposed at a lower end of the process pipe;

an elevation mechanism configured to move the cover upward and downward;

a motor configured to drive the elevation mechanism;

a sealing member configured to seal a space between the cover and a lower end surface of the process pipe; and

a controller configured to:

control a speed of the motor and limit a torque of the motor to be lower than a predetermined upper limit of the torque until the cover reaches a predetermined position when the sealing member is separated from a surface of the cover or the lower end surface of the process pipe such that the substrate is maintained at a rest position in the boat during a recovery from a deformation of the cover occurring when the sealing member is separated from the surface of the cover or the lower end surface of the process pipe; monitor a current position of the cover; and control a rotation of the motor based on a difference between the current position of the cover and a target position of the cover after the cover reaches the predetermined position.

2. The substrate processing apparatus of claim 1 , wherein the controller is configured to stop the motor when the current position reaches the target position.

3. The substrate processing apparatus of claim 1 , wherein the predetermined upper limit of the torque is set such that an acceleration of the boat is equal to or smaller than a gravitational acceleration during the recovery from the deformation of the cover.

4. The substrate processing apparatus of claim 1 , wherein an upper limit of the torque is the cover reaches the predetermined position.

5. A method of manufacturing a semiconductor device, the method comprising:

opening a furnace port of a process pipe by lowering a cover sealing the furnace port via a sealing member after a substrate accommodated in a boat is processed within the process pipe and simultaneously unloading the boat from the process pipe via the furnace port; and

controlling a speed of a motor configured to drive an elevation mechanism configured to move the cover upward and downward and simultaneously limiting a torque of the motor to be lower than a predetermined upper limit of the torque until the cover reaches a predetermined position when the sealing member is separated from a surface of the cover or a lower end surface of the process pipe such that the substrate is maintained at a rest position in the boat during a recovery from a deformation of the cover occurring when the sealing member is separated from the surface of the cover or the lower end surface of the process pipe, and controlling a rotation of the motor based on a difference between a current position of the cover and a target position of the cover after the cover reaches the predetermined position.

6. A method of opening a furnace port of a process pipe, the method comprising:

controlling a speed of a motor configured to drive an elevation mechanism configured to move a cover upward and downward and simultaneously limiting a torque of the motor to be lower than a predetermined upper limit of the torque until the cover reaches a predetermined position when a sealing member is separated from a surface of the cover or a lower end surface of the process pipe such that a substrate is maintained at a rest position in a boat during a recovery from a deformation of the cover occurring when the sealing member is separated from the surface of the cover or the lower end surface of the process pipe, and controlling a rotation of the motor based on a difference between a current position of the cover and a target position of the cover after the cover reaches the predetermined position.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2011
From: ABURATANI, YUKINORI; SHIMADA, MASAKAZU; MORITA, OSAMU
To: HITACHI KOKUSAI ELECTRIC INC.
Reel/Frame 025770/0296 →
Priority Claims (3)
JP 2010-003644 · Jan 12, 2010 · national
JP 2010-003884 · Jan 12, 2010 · national
JP 2010-227766 · Oct 7, 2010 · national
Continuity (1)
Related Publication 20110170989A1 · Jul 14, 2011