Microlithographic projection exposure apparatus
View Patent ↗A projection exposure apparatus has a projection lens with an object plane, an image plane, an optical axis and a non-telecentric entrance pupil. The apparatus further comprises an illumination system having an intermediate field plane and a field stop. The field stop is positioned in or in close proximity to the intermediate field plane and defines an illuminated field in the object plane that does not contain the optical axis of the projection lens. The illumination system is configured such that, in the object plane, a mean of the angles formed between all principal rays emanating from the intermediate field plane on the one hand and the optical axis of the projection lens on the other hand differs from 0°.
1. A system, comprising:
a field stop and
a field stop lens comprising:
a first lens that images the field stop onto an intermediate image plane; and
a second lens that images the intermediate image plane onto an image plane,
wherein the system is a microlithographic exposure apparatus illumination system that is configured to illuminate a mask positioned on a mask plane.
2. The system of claim 1 , further comprising a correction element positioned in or in close proximity to the intermediate image plane.
3. The system of claim 2 , wherein the correction element is positioned within 100 mm off the intermediate image plane.
4. The system of claim 3 , wherein the correction element is positioned within 30 mm off the intermediate image plane.
5. The system of claim 2 , wherein the correction element is a grey filter.
6. The system of claim 2 , wherein the correction element is a refractive or a diffractive optical element.
7. The system of claim 2 , wherein the correction element is a stop.
8. The system of claim 1 , wherein the correction element comprises static or individually movable semi-transparent or opaque fingers for intensity distribution control.
9. The system of claim 1 , wherein the correction element is a lens group.
10. The system of claim 9 , wherein the lens group includes at least one aspherical lens element.
11. The system of claim 1 , wherein the correction element is a polarization manipulating optical element.
12. The system of claim 11 , wherein the polarization manipulating optical element is a polarizer.
13. The system of claim 12 , wherein the polarization manipulating optical element is a rotator that rotates the polarization direction of incident linearly polarized light.
14. The system of claim 1 , wherein the correction element comprises a layered structure having a transmission that is dependent on the angle of incidence of an impinging light ray.
15. The system of claim 1 , wherein the correction element is received in a holder configured to allow adjustment of the position of the correction element.
16. The system of claim 15 , wherein the holder is configured to allow displacement of the correction element along an optical axis of the illumination system.
17. The system of claim 15 , wherein the holder is configured to allow displacement of the correction element along a direction that is inclined to an optical axis of the illumination system.
18. The system of claim 15 , wherein the holder is configured to allow the correction element to tilt.
19. The system of claim 15 , wherein the holder is configured to allow the correction element to deform.
20. The system of claim 15 , wherein the holder is an exchange holder configured to receive different correction elements.
21. A system, comprising:
the microlithographic exposure apparatus illumination system according to claim 1 , wherein the system is a microlithographic exposure apparatus.
22. A method, comprising:
a) providing a substrate supporting a light sensitive layer;
b) providing a mask containing structures to be imaged onto the light sensitive layer;
c) providing a system according to claim 1 ;
d) projecting at least a part of the mask onto the light sensitive layer.
23. A method according to claim 22 , wherein the method makes a micro structured device.