IP Library Granted Patent US 8,750,040
Granted Patent B2
US 8,750,040 · App. 13/011,223 · Granted Jun 10, 2014

Memory devices having source lines directly coupled to body regions and methods

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,750,040
App. No.
13/011,223
Granted
Jun 10, 2014
Kind
B2
Abstract

Memory devices, memory cell strings and methods of operating memory devices are shown. Configurations described include directly coupling an elongated body region to a source line. Configurations and methods shown should provide a reliable bias to a body region for memory operations such as erasing.

Claims (32)

1. A memory device, comprising:

an elongated body region, having a source region coupled to a first end, and a drain region coupled to a second end;

a plurality of gates along a length of the elongated body region, each of the plurality of gates being separated from the elongated body region by at least a charge storage structure; and

a source line directly coupled to the body region.

2. The memory device of claim 1 , wherein the elongated body region is oriented vertically.

3. The memory device of claim 1 , wherein the elongated body region is oriented horizontally.

4. The memory device of claim 1 , wherein the elongated body region forms a “U” shape.

5. The memory device of claim 1 , further including a first select gate adjacent to a first end of the elongated body region and a second select gate adjacent to a second end of the elongated body region.

6. A memory device, comprising:

a p type elongated body region, having an n type source region coupled to a first end, and an n type drain region coupled to a second end;

a plurality of gates along a length of the p type elongated body region, each of the plurality of gates being separated from the p type body region by at least a respective charge storage structure;

a first select gate adjacent to a first end of the body region;

a second select gate adjacent to a second end of the body region;

a source line directly coupled to the p type elongated body region at an end of the body region;

wherein the n type source region substantially surrounds a cross section of an end of the p type elongated body region and is also coupled to the source line.

7. The memory device of claim 6 , wherein at least the end of the p type elongated body region is formed from p+ doped polysilicon.

8. The memory device of claim 6 , wherein the n type source region is formed from n+ polysilicon.

9. The memory device of claim 6 , wherein the n type drain region is formed from n+ polysilicon.

10. The memory device of claim 6 , wherein the p type elongated body region forms a “U” shape.

11. The memory device of claim 10 , wherein the source line is stacked on top of the n type source region.

12. A memory device, comprising:

a U shaped memory cell string, including:

an elongated body region, having a first and second upward facing end;

a drain region coupled to the first upward facing end;

a source region coupled to the second upward facing end;

a plurality of gates along a length of the elongated body region;

a data line coupled to the drain region; and

a source line directly coupled to the second upward facing end of the elongated body region and coupled to the source region.

13. The memory device of claim 12 , wherein the source line and the source region are shared with an adjacent memory cell string.

14. The memory device of claim 12 , wherein the source region substantially surrounds a cross section of the second upward facing end of the elongated body region.

15. The memory device of claim 12 , wherein the gates are shared with an adjacent memory cell string.

16. The memory device of claim 14 , wherein a first portion of the gates are shared with a first adjacent memory cell string and wherein a second portion of the gates are shared with a second adjacent memory cell string.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2023
From: MICRON TECHNOLOGY, INC.
To: LODESTAR LICENSING GROUP, LLC
Reel/Frame 064986/0353 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 2, 2011
From: GODA, AKIRA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 026387/0150 →