IP Library Granted Patent US 8,555,719
Granted Patent B2
US 8,555,719 · App. 13/012,643 · Granted Oct 15, 2013

MEMS sensor with folded torsion springs

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Quick Facts
Patent No.
US 8,555,719
App. No.
13/012,643
Granted
Oct 15, 2013
Kind
B2
Abstract

A microelectromechanical systems (MEMS) sensor ( 40 ) includes a substrate ( 46 ) and a suspension anchor ( 54 ) formed on a planar surface ( 48 ) of the substrate ( 46 ). A first folded torsion spring ( 58 ) and a second folded torsion spring ( 60 ) interconnect the movable element ( 56 ) with the suspension anchor ( 54 ) to suspend the movable element ( 56 ) above the substrate ( 46 ). The folded torsion springs ( 58, 60 ) are each formed from multiple segments ( 76 ) that are linked together by bar elements ( 78 ) in a serpentine fashion. The folded torsion springs ( 58, 60 ) have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid ( 84 ) of the suspension anchor ( 54 ).

Claims (47)

1. A microelectromechanical systems (MEMS) sensor comprising:

a substrate;

a movable element positioned in spaced apart relationship above a surface of said substrate, said movable element being adapted for motion relative to a rotational axis positioned between first and second ends of said movable element;

a suspension anchor formed on said surface of said substrate, a centroid of suspension anchor being located at said rotational axis;

a first folded torsion spring interconnecting said movable element with said suspension anchor, said first folded torsion spring having a first end coupled to said suspension anchor; and

a second folded torsion spring interconnecting said movable element with said suspension anchor, said second folded torsion spring having a second end coupled to said suspension anchor, said first and second folded torsion springs having a substantially equivalent shape, said second folded torsion spring being generally oriented in rotational symmetry relative to said first folded torsion spring about said centroid of said suspension anchor, and each of said first and second ends of said first and second folded torsion springs being displaced away from and on opposite sides of said rotational axis by a substantially equivalent distance.

2. A MEMS sensor as claimed in claim 1 wherein said second folded torsion spring is located in an orientation that is rotated about said centroid of said suspension anchor approximately one hundred and eighty degrees relative to said first folded torsion spring.

3. A MEMS sensor as claimed in claim 1 wherein each of said first and second folded torsion springs is arranged generally parallel to said rotational axis.

4. A MEMS sensor as claimed in claim 1 wherein each of said first and second folded torsion springs includes multiple segments aligned substantially parallel to said rotational axis, said segments being linked together in serpentine fashion by bar elements.

5. A MEMS sensor as claimed in claim 4 wherein each of said bar elements exhibits a first length that is less than a second length of said segments.

6. A MEMS sensor as claimed in claim 4 wherein said each of said first and second folded torsion springs includes at least three of said segments.

7. A MEMS sensor as claimed in claim 1 wherein:

said movable element includes an opening extending through said movable element, said opening being delineated by an inner edge portion of said movable element;

said suspension anchor is centered in said opening;

said first end of said first folded torsion spring is coupled to a first side of said suspension anchor;

said second end of said second folded torsion spring is coupled to a second side of said suspension anchor opposite said first side;

said first folded torsion spring has a third end coupled to said inner edge portion of said movable element; and

said second folded torsion spring has a fourth end coupled to said inner edge portion of said movable element.

8. A MEMS sensor as claimed in claim 1 wherein said sensor further comprises a sensing element disposed on said substrate beneath said movable element, said sensing element being adapted to detect movement of said movable element about said rotational axis from a first position to a second position along an axis perpendicular to a plane of said substrate.

9. A device comprising:

a microelectromechanical systems (MEMS) sensor, said MEMS sensor comprising:

a substrate;

a movable element positioned in spaced apart relationship above a surface of said substrate, said movable element being adapted for motion relative to a rotational axis positioned between first and second ends of said movable element;

a suspension anchor formed on said surface of said substrate, said suspension anchor having a centroid located at said rotational axis;

a first folded torsion spring interconnecting said movable element with said suspension anchor, said first folded torsion spring having a first end coupled to said suspension anchor; and

a second folded torsion spring interconnecting said movable element with said suspension anchor, said second folded torsion spring having a second end coupled to said suspension anchor, said first and second folded torsion springs having a substantially equivalent shape, said second folded torsion spring being generally oriented in rotational symmetry relative to said first folded torsion spring about said centroid of said suspension anchor, each of said first and second ends of said first and second folded torsion springs being displaced away from and on opposite sides of said rotational axis by a substantially equivalent distance, and each of said first and second folded torsion springs includes multiple segments aligned substantially parallel to said rotational axis, said segments being linked together in serpentine fashion by bar elements.

10. A device as claimed in claim 9 wherein said second folded torsion spring is located in an orientation that is rotated about said centroid of said suspension anchor approximately one hundred and eighty degrees relative to said first folded torsion spring.

11. A device as claimed in claim 9 wherein each of said bar elements exhibits a first length that is less than a second length of said segments.

12. A device as claimed in claim 9 wherein said each of said first and second folded torsion springs includes at least three segments.

13. A device as claimed in claim 9 wherein:

said movable element includes an opening extending through said movable element, said opening being delineated by an inner edge portion of said movable element;

said suspension anchor is centered in said opening;

said first end of said first folded torsion spring is coupled to a first side of said suspension anchor;

said second end of said second folded torsion spring is coupled to a second side of said suspension anchor opposite said first side;

said first folded torsion spring has a third end coupled to said inner edge portion of said movable element; and

said second folded torsion spring has a fourth end coupled to said inner edge portion of said movable element.

14. A device as claimed in claim 9 wherein said MEMS sensor further comprises a sensing element disposed on said substrate beneath said movable element, said sensing element being adapted to detect movement of said movable element about said rotational axis from a first position to a second position along an axis perpendicular to a plane of said substrate.

15. A microelectromechanical (MEMS) sensor comprising:

a substrate;

a movable element positioned in spaced apart relationship above a surface of said substrate, said movable element including an opening extending through said movable element, said opening being delineated by an inner edge portion of said movable element, and said movable element is adapted for motion relative to a rotational axis positioned between first and second ends of said movable element;

a suspension anchor formed on said surface of said substrate and centered in said opening;

a first folded torsion spring interconnecting said movable element with said suspension anchor and arranged generally parallel to said rotational axis, said first folded torsion spring having a first end coupled to a first side of said suspension anchor and a second end coupled to said inner edge portion of said movable element; and

a second folded torsion spring interconnecting said movable element with said suspension anchor and arranged generally parallel to said rotational axis, said second folded torsion spring having a third end coupled to a second side of said suspension anchor opposite said first side and a fourth end coupled to said inner edge portion of said movable element, said first and second folded torsion springs having a substantially equivalent shape, said second folded torsion spring being generally oriented in rotational symmetry relative to said first folded torsion spring about a centroid of said suspension anchor, and each of said first and third ends of said first and second folded torsion springs is displaced away from and on opposite sides of said rotational axis by a substantially equivalent distance.

16. A MEMS sensor as claimed in claim 15 wherein said second folded torsion spring is located in an orientation that is rotated about said centroid of said suspension anchor approximately one hundred and eighty degrees relative to said first folded torsion spring.

17. MEMS sensor as claimed in claim 15 wherein said centroid of suspension anchor is located at said rotational axis.

18. A MEMS sensor as claimed in claim 15 wherein each of said first and second folded torsion springs includes at least three segments aligned parallel to said rotational axis, said segments being linked together in serpentine fashion by bar elements, each of said bar elements exhibiting a first length that is less than a second length of said segments.

19. A MEMS sensor as claimed in claim 15 further comprising a sensing element disposed on said substrate beneath said movable element, said sensing element being adapted to detect movement of said movable element about said rotational axis from a first position to a second position along an axis perpendicular to a plane of said substrate.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2011
From: MCNEIL, ANDREW C.; LI, GARY G.
To: FREESCALE SEMICONDUCTOR, INC.
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