IP Library Granted Patent US 8,539,836
Granted Patent B2
US 8,539,836 · App. 13/012,671 · Granted Sep 24, 2013

MEMS sensor with dual proof masses

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Quick Facts
Patent No.
US 8,539,836
App. No.
13/012,671
Granted
Sep 24, 2013
Kind
B2
Abstract

A microelectromechanical systems (MEMS) sensor ( 20 ) includes a substrate ( 26 ) and suspension anchors ( 34, 36 ) formed on a planar surface ( 28 ) of the substrate ( 26 ). The MEMS sensor ( 20 ) further includes a first movable element ( 38 ) and a second movable element ( 40 ) suspended above the substrate ( 26 ). Compliant members ( 42, 44 ) interconnect the first movable element ( 38 ) with the suspension anchor 34 and compliant members ( 46, 48 ) interconnect the second movable element ( 40 ) with the suspension anchor ( 36 ). The movable elements ( 38, 40 ) have an equivalent shape. The movable elements may be generally rectangular movable elements ( 38, 40 ) or L-shaped movable elements ( 108, 110 ) in a nested configuration. The movable elements ( 38, 40 ) are oriented relative to one another in rotational symmetry about a point location ( 94 ) on the substrate ( 26 ).

Claims (56)

1. A microelectromechanical systems (MEMS) sensor comprising:

a substrate;

a first movable element positioned in spaced apart relationship above a generally planar surface of said substrate, said first movable element being adapted for rotational motion in a first direction in response to acceleration along an axis perpendicular to said planar surface of said substrate, said rotational motion occurring about a first rotational axis positioned between first and second ends of said first movable element; and

a second movable element positioned in spaced apart relationship above said surface of said substrate, said second movable element being adapted for rotational motion in a second direction in response to said acceleration, said rotational motion occurring about a second rotational axis positioned between third and fourth ends of said second movable element, said second direction being opposite to said first direction, said first and second movable elements having a substantially equivalent shape and said second movable element being generally oriented in rotational symmetry relative to said first movable element about a point location on said planar surface of said substrate such that said first and second movable elements are disposed beside one another along a direction of a common rotational axis, and said first and second rotational axes extend along said common rotational axis, wherein:

said first movable element includes a first section between said first rotational axis and said first end and a second section between said first rotational axis and said second end, said first rotational axis being offset between said first and second ends such that a first length of said first section between said first rotational axis and said first end is greater than a second length of said second section between said first rotational axis and said second end; and

said second movable element includes a third section between said second rotational axis and said third end and a fourth section between said second rotational axis and said fourth end, said second rotational axis being offset between said third and fourth ends such that a third length of said third section between said second rotational axis and said third end is less than a fourth length of said fourth section between said second rotational axis and said fourth end.

2. A MEMS sensor as claimed in claim 1 wherein said second movable element is located in an orientation that is rotated about said point location approximately one hundred and eighty degrees relative to said first movable element.

3. A MEMS sensor as claimed in claim 1 further comprising:

a first suspension anchor formed on said planar surface of said substrate and approximately centered on said common rotational axis;

a first pair of compliant members interconnecting said first movable element with said first suspension anchor, said first pair of compliant members enabling said rotational motion of said first movable element about said first rotational axis;

a second suspension anchor formed on said surface of said substrate and approximately centered on said common rotational axis; and

a second pair of compliant members interconnecting said second movable element with said second suspension anchor, said second pair of compliant members enabling said rotational motion of said second movable element about said second rotational axis.

4. A MEMS sensor as claimed in claim 1 wherein:

said first length is substantially equivalent to said fourth length; and

said second length is substantially equivalent to said third length.

5. A MEMS sensor as claimed in claim 1 wherein:

said first movable element includes a first lateral extension section extending from a first side of said first section, said first lateral extension section being located proximate said third end of said second movable element; and

said second movable element includes a second lateral extension section extending from a second side of said fourth section, said second lateral extension section being located proximate said second end of said first movable element.

6. A MEMS sensor as claimed in claim 5 wherein:

said first movable element including said first lateral extension section forms a first L-shaped movable element; and

said second movable element including said second lateral extension section forms a second L-shaped movable element, said first and second L-shaped movable elements being arranged in a nested configuration without contact between said first and second L-shaped movable elements.

7. A MEMS sensor as claimed in claim 1 further comprising:

a first sensing element disposed on said substrate beneath each of said first and second movable elements; and

a second sensing element disposed on said substrate beneath said each of said first and second movable elements, each of said first and second sensing elements being displaced away from and on opposite sides of said common rotational axis by a substantially equivalent distance, and said first and second sensing elements being adapted to detect movement of said first and second movable elements about said common rotational axis along an axis perpendicular to said planar surface of said substrate.

8. A device comprising:

a microelectromechanical systems (MEMS) sensor, said MEMS sensor comprising:

a substrate;

a first movable element positioned in spaced apart relationship above a generally planar surface of said substrate and adapted for rotational motion about a first rotational axis positioned between first and second ends of said first movable element; and

a second movable element positioned in spaced apart relationship above said surface of said substrate and adapted for rotational motion about a second rotational axis positioned between third and fourth ends of said second movable element, said first and second rotational axes extending alone a common rotational axis, said first and second movable elements having a substantially equivalent shape and said second movable element being generally oriented in rotational symmetry relative to said first movable element about a point location on said planar surface of said substrate such that said first and second movable elements are disposed beside one another along a direction of said common rotational axis, said second movable element being located in an orientation that is rotated about said point location approximately one hundred and eighty degrees relative to said first movable element, wherein:

said first movable element includes a first section between said first rotational axis and said first end and a second section between said first rotational axis and said second end, said first rotational axis being offset between said first and second ends such that a first length of said first section between said first rotational axis and said first end is greater than a second length of said second section between said first rotational axis and said second end; and

said second movable element includes a third section between said second rotational axis and said third end and a fourth section between said second rotational axis and said fourth end, said second rotational axis being offset between said third and fourth ends such that a third length of said third section between said second rotational axis and said third end is less than a fourth length of said fourth section between said second rotational axis and said fourth end.

9. A device as claimed in claim 8 wherein:

said first movable element is adapted for said rotational motion about said first rotational axis in a first direction in response to acceleration along an axis perpendicular to said planar surface of said substrate; and

said second movable element is adapted for said rotational motion about said second rotational axis in a second direction in response to said acceleration, said second direction being opposite to said first direction.

10. A device as claimed in claim 8 wherein:

said first movable element includes a first lateral extension section extending from a first side of said first section, said first lateral extension section being located proximate said third end of said second movable element; and

said second movable element includes a second lateral extension section extending from a second side of said fourth section, said second lateral extension section being located proximate said second end of said first movable element.

11. A device as claimed in claim 8 further comprising:

a first sensing element disposed on said substrate beneath each of said first and second movable elements; and

a second sensing element disposed on said substrate beneath said each of said first and second movable elements, each of said first and second sensing elements being displaced away from and on opposite sides of said common rotational axis by a substantially equivalent distance, and said first and second sensing elements being adapted to detect movement of said first and second movable elements about said common rotational axis along an axis perpendicular to said planar surface of said substrate.

12. A microelectromechanical systems (MEMS) sensor comprising:

a substrate;

a first movable element positioned in spaced apart relationship above a generally planar surface of said substrate;

a second movable element positioned in spaced apart relationship above said surface of said substrate, said first and second movable elements having a substantially equivalent shape and said second movable element being generally oriented in rotational symmetry relative to said first movable element about a point location on said planar surface of said substrate such that said first and second movable elements are disposed beside one another along a direction of a common rotational axis, and said first and second rotational axes extend along said common rotational axis, said second movable element being located in an orientation that is rotated about said point location approximately one hundred and eighty degrees relative to said first movable element, each of said first and second movable elements being adapted for rotational motion about said common rotational axis;

a first sensing element disposed on said substrate beneath each of said first and second movable elements; and

a second sensing element disposed on said substrate beneath said each of said first and second movable elements, each of said first and second sensing elements being displaced away from and on opposite sides of said common rotational axis by a substantially equivalent distance, and said first and second sensing elements being adapted to detect movement of said first and second movable elements about said common rotational axis along an axis perpendicular to said planar surface of said substrate, wherein:

said first movable element includes first and second ends, a first section between said common rotational axis and said first end, and a second section between said common rotational axis and said second end, wherein a first length of said first section between said common rotational axis and said first end is greater than a second length of said second section between said common rotational axis and said second end; and

said second movable element includes third and fourth ends, a third section between said common rotational axis and said third end, and a fourth section between said common rotational axis and said fourth end, wherein a third length of said third section between said common rotational axis and said third end is less than a fourth length of said fourth section between said common rotational axis and said fourth end.

13. A MEMS sensor as claimed in claim 12 further comprising:

a first suspension anchor formed on said planar surface of said substrate and approximately centered on said common rotational axis;

a first pair of compliant members interconnecting said first movable element with said first suspension anchor, said first pair of compliant members enabling said rotational motion of said first movable element;

a second suspension anchor formed on said planar surface of said substrate and approximately centered on said common rotational axis; and

a second pair of compliant members interconnecting said second movable element with said second suspension anchor, said second pair of compliant members enabling said rotational motion of said second movable element.

14. A MEMS sensor as claimed in claim 12 wherein:

said first movable element includes a first lateral extension section extending from a first side of said first section, said first lateral extension section being located proximate said third end of said second movable element; and

said second movable element includes a second lateral extension section extending from a second side of said fourth section, said second lateral extension section being located proximate said second end of said first movable element such that said first and second movable elements are arranged in a nested configuration without contact between said first and second movable elements.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027621/0928 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 24, 2011
From: MCNEIL, ANDREW C.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 025687/0677 →