Test head and semiconductor wafer test apparatus comprising same
View Patent ↗Providing a test head capable of suppressing a probe card from bending. The test head 40 comprises: a test head main body 51 having a frame 51 ; an interface apparatus 60 electrically connecting a probe card 20 and the test head main body 50 with each other; and a brake unit 80 positioned between the probe card 20 and the frame 51 to transmit a pressing force F applied to the probe card 20 to the frame 51.
1. A test head comprising:
a test head main body having a frame; and
an interface apparatus electrically connecting a probe card and the test head main body with each other and a stiffener that reinforces the probe card, wherein
the test head further comprises:
a transmitter positioned between the probe card and the frame and configured to transmit a pressing force applied to the probe card to the frame;
a holding mechanism provided at a top plate of the interface apparatus and configured to hold the probe card; and
a limiter provided at the top plate and configured to limit a movement of the holding mechanism in a direction departing from the probe card reinforced by the stiffener, wherein
the transmitter has:
a contact member being movable relative to either one of the limiter or the frame and contacting other of the limiter or the frame; and
a lock mechanism provided at either one of the limiter or the frame and configured to lock a relative movement of the contact member.
2. The test head as set forth in claim 1 , wherein
the holding mechanism grasps a clamp head provided at a center portion of the probe card.
3. The test head as set forth in claim 1 , wherein
the top plate has a coupling portion which is to be coupled with a head plate of a prober,
a center of the probe card is nearer to the contact member than the coupling portion with respect to a planar view.
4. The test head as set forth in claim 1 , wherein
the transmitter has a biasing member that biases the contact member.
5. The test head as set forth in claim 1 , wherein
the lock mechanism accepts a relative movement of the contact member before the test head main body is positioned relative to a prober, and the lock mechanism locks the relative movement of the contact member after the test head main body is positioned relative to the prober.
6. A test head comprising:
a test head main body having a frame; and
an interface apparatus electrically connecting a probe card and the test head main body with each other and a stiffener that reinforces the probe card, wherein
the test head further comprises:
a holding mechanism provided at a top plate of the interface apparatus and configured to hold the probe card;
a limiter provided at the top plate and configured to limit a movement of the holding mechanism in a direction departing from the probe card reinforced by the stiffener; and
a transmitter configured to transmit a pressing force applied to the probe card to the frame, the transmitter having:
a contact member being movable relative to either one of the top plate or the frame and contacting other of the top plate or the frame; and
a lock mechanism provided at either one of the top plate or the frame and configured to lock a relative movement of the contact member.
7. The test head as set forth in claim 6 , wherein
the holding mechanism grasps a clamp head provided at a center portion of the probe card.
8. The test head as set forth in claim 6 , wherein
the top plate has a coupling portion which is to be coupled with a head plate of a prober,
a center of the probe card is nearer to the contact member than the coupling portion with respect to a planar view.
9. The test head as set forth in claim 6 , wherein
the transmitter has a biasing member that biases the contact member.
10. The test head as set forth in claim 6 , wherein
the lock mechanism accepts a relative movement of the contact member before the test head main body is positioned relative to a prober, and the lock mechanism locks the relative movement of the contact member after the test head main body is positioned relative to the prober.
11. A semiconductor wafer test apparatus comprising:
the test head as set forth in claim 6 ; and
a prober pressing a semiconductor wafer to the probe card.
12. A test head comprising:
a test head main body having a frame; and
an interface apparatus electrically connecting a probe card and the test head main body with each other and a stiffener that reinforces the probe card, wherein
the test head further comprises:
a holding mechanism provided at a top plate of the interface apparatus and configured to hold the probe card;
a limiter provided at the top plate and configured to limit a movement of the holding mechanism in a direction departing from the probe card reinforced by the stiffener; and
a transmitter configured to transmit a pressing force applied to the probe card to the frame, the transmitter having:
a contact member being movable relative to either one of the holding mechanism or the frame and contacting other of the holding mechanism or the frame; and
a lock mechanism provided at either one of the holding mechanism or the frame and configured to lock a relative movement of the contact member.
13. The test head as set forth in claim 12 , wherein
the holding mechanism grasps a clamp head provided at a center portion of the probe card.
14. The test head as set forth in claim 12 , wherein
the top plate has a coupling portion which is to be coupled with a head plate of a prober,
a center of the probe card is nearer to the contact member than the coupling portion with respect to a planar view.
15. The test head as set forth in claim 12 , wherein
the transmitter has a biasing member that biases the contact member.
16. The test head as set forth in claim 12 , wherein
the lock mechanism accepts a relative movement of the contact member before the test head main body is positioned relative to a prober, and the lock mechanism locks the relative movement of the contact member after the test head main body is positioned relative to the prober.