Optical semiconductor package and optical semiconductor device
View Patent ↗Leads 3 and a metal block 2 are resin molded only in a region surrounded by a base bottom 1 d , and the surface of the metal block 2 at the bottom of a cavity 10 is not composed of a resin but a metallic component or a material having high resistance to discoloration and degradation.
1. An optical semiconductor package comprising:
a base including a ring and a ring-shaped base bottom formed under the ring, the base bottom being larger in internal diameter than the ring;
leads each of which comprise an outer lead serving as an external electrode;
at least one block that is provided in the base bottom and has a partially exposed top surface in the ring;
an element mounting part provided as a region for mounting an optical semiconductor element on the surface of the block exposed in the ring;
a lead placement part formed as a region for placing the leads on the top surface of the block with a step formed between the lead placement part and the element mounting part;
a sealing material that seals and holds the block and the leads in a region of the base bottom; and
a cavity as a region surrounded by a side of the ring and the top surface of the block,
wherein at least the top surface of the block is made of an inorganic material having a reflectivity of at least 83% at a light wavelength of 460 nm, and only the top surface of the block is exposed in a bottom of the cavity.
2. The optical semiconductor package according to claim 1 , wherein the overall block is made of the inorganic material having a reflectivity of at least 83% at a light wavelength of 460 nm.
3. The optical semiconductor package according to claim 1 , wherein the inorganic material having a reflectivity of at least 83% at a light wavelength of 460 nm is an Au—Ag alloy.
4. The optical semiconductor package according to claim 1 , wherein the block has a back side such that the back side opposed to the top surface of the block is exposed from the sealing material.
5. The optical semiconductor package according to claim 1 , wherein the at least one block comprises multiple blocks electrically isolated from each other.
6. The optical semiconductor package according to claim 1 , wherein the ring is made of one of a ceramic and a glass-ceramic.
7. The optical semiconductor package according to claim 1 , wherein the ring is composed of a highly-reflective glass-ceramic containing alumina of 50 mass % to 60 mass %.
8. The optical semiconductor package according to claim 1 , wherein the sealing material is composed of one of a glass and a thermosetting resin.
9. An optical semiconductor device comprising:
the optical semiconductor package according to claim 1 ;
the optical semiconductor element mounted on the element mounting part and electrically connected to the leads; and
a light-transmissive resin for molding an inside of the cavity.