Patent Assignment
Reel/Frame 061362/0441
Change of Name
Recorded: 2022-08-31
Pages: 7
Assignor
PANASONIC CORPORATION
Executed: 2022-04-01
Assignee
PANASONIC HOLDINGS CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties
(7)
Multilayered Lead Frame for a Semiconductor Light-Emitting Device
Multilayered Lead Frame for a Semiconductor Light-Emitting Device
Multilayered Lead Frame for a Semiconductor Light-Emitting Device
Lead Frame for Semiconductor Device and Method of Manufacturing of the Same
Optical Semiconductor Package and Optical Semiconductor Device
Lead, Wiring Member, Package Part, Metal Part Provided with Resin and Resin-Sealed Semiconductor Device, and Methods for Producing Same
Lead, Wiring Member, Package Component, Metal Component with Resin, Resin-Encapsulated Semiconductor Device, and Methods for Producing the Same
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 18, 2006
From: TOMOHIRO, HIDEKAZU; FUJII, MASAYUKI; SATOU, NORIO; YAMADA, TOMOYUKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 017485/0021 →
Change of Name
Nov 21, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0570 →
Assignment of Assignor's Interest
Mar 8, 2011
From: NAKAI, HIROSHI
To: PANASONIC CORPORATION
Reel/Frame 025914/0484 →
Assignment of Assignor's Interest
Mar 14, 2011
From: IMANISHI, YASUKO; FUKUNAGA, TAKAHIRO
To: PANASONIC CORPORATION
Reel/Frame 025943/0285 →
Assignment of Assignor's Interest
Mar 23, 2011
From: FUKUNAGA, TAKAHIRO
To: PANASONIC CORPORATION
Reel/Frame 026001/0767 →
Assignment of Assignor's Interest
Mar 25, 2011
From: FUKUNAGA, TAKAHIRO; IMANISHI, YASUKO
To: PANASONIC CORPORATION
Reel/Frame 026019/0283 →