Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same
View Patent ↗A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics.
1. A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein
the organic compound has a structure such that the following (i) and (ii) are each arranged therein: (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening,
the principal chain of the organic compound comprises:
one or more chains selected from the group consisting of a methylene chain, a fluoromethylene chain, a siloxane chain, and a glycol chain; and
one or more polar groups selected from the group consisting of hydroxyl radicals, ketone, thioketone, primary amine, secondary amine, and aromatic compounds, and
the first functional group bonds with the leads.
2. The wiring member of claim 1 , wherein
the principal chain of the organic compound further comprises, closer to the other extremity thereof than the N-containing heterocycle, one or more skeletons selected from the group consisting of an aryl skeleton, an acene skeleton, a pyrene skeleton, a phenanthrene skeleton, and a fluorene skeleton.
3. A metal component with resin where resin is affixed to a portion of the wiring member of claim 1 , wherein
the organic film adheres to and is formed over a greater area than the surface area of the wiring unit where the resin is affixed.
4. The metal component with resin of claim 3 , wherein
with respect to the wiring member, a reflector which possesses a mortar-shaped surface and on which an LED chip is mounted is arranged,
a plating layer made of Ag is formed over the surface of the reflector,
the organic film further adheres to the surface of the plating layer, and
the first functional group of the organic compound bonds with the plating layer.
5. LED device, wherein
an LED chip is arranged in a reflector of a metal component with resin of claim 4 , and transparent resin fills the reflector surface.
6. A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein
the organic compound has a structure such that the following (i) and (ii) are each arranged therein: (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening,
the principal chain of the organic compound comprises:
one or more chains selected from the group consisting of a methylene chain, a fluoromethylene chain, a siloxane chain, and a glycol chain; and
one or more skeletons selected from the group consisting of an aromatic imide skeleton and an amide skeleton, and
the first functional group bonds with the leads.
7. The wiring member of claim 6 , wherein
the principal chain of the organic compound further comprises, closer to the other extremity thereof than the N-containing heterocycle, one or more skeletons selected from the group consisting of an aryl skeleton, an acene skeleton, a pyrene skeleton, a phenanthrene skeleton, and a fluorene skeleton.
8. A metal component with resin where resin is affixed to a portion of the wiring member of claim 6 , wherein
the organic film adheres to and is formed over a greater area than the surface area of the wiring unit where the resin is affixed.
9. The metal component with resin of claim 8 , wherein
with respect to the wiring member, a reflector which possesses a mortar-shaped surface and on which an LED chip is mounted is arranged,
a plating layer made of Ag is formed over the surface of the reflector,
the organic film further adheres to the surface of the plating layer, and
the first functional group of the organic compound bonds with the plating layer.
10. An LED device, wherein
an LED chip is arranged in a reflector of a metal component with resin of claim 9 , and transparent resin fills the reflector surface.
11. A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein
the organic compound has a structure such that the following (i) and (ii) are each arranged therein: (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening,
the principal chain of the organic compound comprises:
a N-containing heterocycle containing two or more N atoms, and
the first functional group bonds with the leads.
12. The wiring member of claim 11 , wherein
the N-containing heterocycle comprises one or more compounds selected from the group consisting of imidazole, triazole, tetrazole, oxydiazole, thiadiazole, pyrimidine, pyridazine, pyridine, and triazine.
13. The wiring member of claim 11 , wherein
the principal chain of the organic compound further comprises, closer to the other extremity thereof than the N-containing heterocycle, one or more skeletons selected from the group consisting of an aryl skeleton, an acene skeleton, a pyrene skeleton, a phenanthrene skeleton, and a fluorene skeleton.
14. A metal component with resin where resin is affixed to a portion of the wiring member of claim 11 , wherein
the organic film adheres to and is formed over a greater area than the surface area of the wiring unit where the resin is affixed.
15. The metal component with resin of claim 14 , wherein
with respect to the wiring member, a reflector which possesses a mortar-shaped surface and on which an LED chip is mounted is arranged,
a plating layer made of Ag is formed over the surface of the reflector,
the organic film further adheres to the surface of the plating layer, and
the first functional group of the organic compound bonds with the plating layer.
16. An LED device, wherein
an LED chip is arranged in a reflector of a metal component with resin of claim 15 , and transparent resin fills the reflector surface.
17. A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein
the organic compound has a structure such that the following (i) and (ii) are each arranged therein: (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening,
the principal chain of the organic compound comprises one or more skeletons selected from the group consisting of an aryl skeleton, an acene skeleton, a pyrene skeleton, a phenanthrene skeleton, and a fluorene skeleton, and
the first functional group bonds with the leads.
18. A metal component with resin where resin is affixed to a portion of the wiring member of claim 17 , wherein
the organic film adheres to and is formed over a greater area than the surface area of the wiring unit where the resin is affixed.
19. The metal component with resin of claim 18 , wherein
with respect to the wiring member, a reflector which possesses a mortar-shaped surface and on which an LED chip is mounted is arranged,
a plating layer made of Ag is formed over the surface of the reflector,
the organic film further adheres to the surface of the plating layer, and
the first functional group of the organic compound bonds with the plating layer.
20. An LED device, wherein
an LED chip is arranged in a reflector of a metal component with resin of claim 19 , and transparent resin fills the reflector surface.