Patent Assignment
Reel/Frame 026019/0283
Assignment of Assignor's Interest
Recorded: 2011-03-25
Pages: 2
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Lead, Wiring Member, Package Part, Metal Part Provided with Resin and Resin-Sealed Semiconductor Device, and Methods for Producing Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.