GaN substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
A GaN substrate on which an epitaxially grown layer of good quality can be formed is obtained. A GaN substrate as a group III nitride substrate has a surface in which the number of chlorine atoms per square centimeter of the surface is not more than 2×10 14 , and the number of silicon atoms per square centimeter of the surface is not more than 3×10 13 , wherein a plane orientation of the surface is any of a (0001) plane, a (11-20) plane, a (10-12) plane, a (10-10) plane, a (20-21) plane, a (10-11) plane, a (11-21) plane, a (11-22) plane, and a (11-24) plane of a wurtzite structure.
1. A GaN substrate, having a surface in which a number of chlorine atoms per square centimeter of said surface is not more than 2×10 14 , and a number of silicon atoms per square centimeter of said surface is not more than 3×10 13 ,
wherein a plane orientation of said surface is any of a (0001) plane, a (11-20) plane, a (10-12) plane, a (10-10) plane, a (20-21) plane, a (10-11) plane, a (11-21) plane, a (11-22) plane, and a (11-24) plane of a wurtzite structure, and
wherein the chlorine atoms and the silicon atoms adhere to the surface of the substrate.
2. The GaN substrate according to claim 1 , wherein a surface roughness in Ra is not more than 1 nm,
wherein Ra means arithmetical mean roughness.
3. The GaN substrate according to claim 1 , wherein an affected layer formed on said surface has a thickness of not more than 50 nm.
4. An epitaxial layer-provided substrate, comprising:
the GaN substrate according to claim 1 ; and
an epitaxially grown layer formed on a surface of said GaN substrate.
5. A method of manufacturing an epitaxial layer-provided substrate, comprising:
a substrate preparation step of preparing the GaN substrate according to claim 1 ; and
a step of forming an epitaxially grown layer on a surface of the GaN substrate prepared by said substrate preparation step.
6. A method of manufacturing a semiconductor device, comprising:
an epitaxial layer-provided substrate preparation step of performing the method of manufacturing an epitaxial layer-provided substrate according to claim 5 ; and
a step of forming the semiconductor device by performing an electrode formation step and a processing step on the epitaxial layer-provided substrate obtained by said epitaxial layer-provided substrate preparation step.