IP Library Granted Patent US 8,526,477
Granted Patent B2
US 8,526,477 · App. 13/034,329 · Granted Sep 3, 2013

Semiconductor light emitting device

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Quick Facts
Patent No.
US 8,526,477
App. No.
13/034,329
Granted
Sep 3, 2013
Kind
B2
Abstract

A semiconductor light emitting device of one embodiment includes: a substrate; an n-type layer of an n-type nitride semiconductor on the substrate; an active layer of a nitride semiconductor on the n-type semiconductor layer; a p-type layer of a p-type nitride semiconductor on the active layer. The p-type layer has a ridge stripe shape. The device has an end-face layer of a nitride semiconductor formed on an end face of the n-type semiconductor layer, the active layer, and the p-type semiconductor layer. The end face is perpendicular to an extension direction of the ridge stripe shape. The end-face layer has band gap wider than the active layer. The end-face layer has Mg concentration in the range of 5E16 atoms/cm 3 to 5E17 atoms/cm 3 at a region adjacent to the p-type layer.

Claims (28)

1. A semiconductor laser diode comprising:

a substrate;

an n-type layer of an n-type nitride semiconductor on the substrate;

an active layer of a nitride semiconductor on the n-type layer;

a p-type layer of a p-type nitride semiconductor on the active layer, the p-type layer having a ridge stripe shape; and

an end-face layer of a nitride semiconductor formed on an end face of the n-type layer, the active layer, and the p-type layer, the end face being perpendicular to an extension direction of the ridge stripe shape, the end-face layer having a band gap wider than the active layer, the end-face layer having Mg (Magnesium) concentration in the range of 5×10 16 atoms/cm 3 to 5×10 17 atoms/cm 3 at a region adjacent to the p-type layer,

wherein a thickness of the end-face layer in the extension direction of the ridge stripe shape is 10 μm or larger.

2. The semiconductor laser diode according to claim 1 ,

wherein the end-face layer has a layer-stack structure made of a first low-refractive-index layer, a high-refractive-index layer, and a second low-refractive-index layer from the substrate side, the high-refractive-index layer being formed adjacent to the active layer.

3. The device according to claim 2 , wherein a concentration of Al (Aluminum) in the first low-refractive-index layer and the second low-refractive-index layer is higher than that in the high-refractive-index layer.

4. The device according to claim 3 , wherein the active layer is made of In X Ga 1-x N (0<X<1), the first and second low-refractive-index layers are made of Al Y Ga 1-Y N (0<Y<1), and the high-refractive-index layer is made of GaN.

5. A semiconductor laser diode comprising:

a substrate;

an n-type layer of an n-type nitride semiconductor on the substrate;

an active layer of a nitride semiconductor on the n-type layer;

a p-type layer of a p-type nitride semiconductor on the active layer, the p-type layer having a ridge stripe shape; and

an end-face layer of a nitride semiconductor formed on an end face of the n-type layer, the active layer, and the p-type layer, the end face being perpendicular to an extension direction of the ridge stripe shape, the end-face layer having a band gap wider than the active layer, the end-face layer having Mg (Magnesium) concentration in the range of 5×10 16 atoms/cm 3 to 5×10 17 atoms/cm 3 at a region adjacent to the p-type layer,

wherein a thickness of the end-face layer in the extension direction of the ridge stripe shape is 20 μm or larger.

6. A semiconductor laser diode comprising:

a substrate;

an n-type layer of an n-type nitride semiconductor on the substrate;

an active layer of a nitride semiconductor on the n-type layer;

a p-type layer of a p-type nitride semiconductor on the active layer, the p-type layer having a ridge stripe shape; and

an end-face layer of a nitride semiconductor formed on an end face of the n-type layer, the active layer, and the p-type layer, the end face being perpendicular to an extension direction of the ridge stripe shape, the end-face layer having a band gap wider than the active layer, the end-face layer having Mg (Magnesium) concentration in the range of 5×10 16 atoms/cm 3 to 5×10 17 atoms/cm 3 at a region adjacent to the p-type layer,

wherein the end-face layer has a layer-stack structure made of a first low-refractive-index layer, a high-refractive-index layer, and a second low-refractive-index layer from the substrate side, the high-refractive-index layer being formed adjacent to the active layer, and

a thickness of the end-face layer in the extension direction of the ridge stripe shape is 20 μm or larger.

7. The device according to claim 6 , wherein a concentration of Al (Aluminum) in the first low-refractive-index layer and the second low-refractive-index layer is higher than that of Al in the high-refractive-index layer.

8. The device according to claim 7 , wherein the active layer is made of In X Ga 1-x N (0<X<1), the first and second low-refractive-index layers are made of Al Y Ga 1-Y N (0<Y<1), and the high-refractive-index layer is made of GaN.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: ALPAD CORPORATION
Reel/Frame 044591/0755 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 24, 2011
From: SAITO, SHINJI; HWANG, JONGIL; NUNOUE, SHINYA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 025860/0032 →