Semiconductor charge storage apparatus and methods
Methods of forming multi-tiered semiconductor devices are described, along with apparatus and systems that include them. In one such method, an opening is formed in a tier of semiconductor material and a tier of dielectric. A portion of the tier of semiconductor material exposed by the opening is processed so that the portion is doped differently than the remaining semiconductor material in the tier. At least substantially all of the remaining semiconductor material of the tier is removed, leaving the differently doped portion of the tier of semiconductor material as a charge storage structure. A tunneling dielectric is formed on a first surface of the charge storage structure and an intergate dielectric is formed on a second surface of the charge storage structure. Additional embodiments are also described.
1. An apparatus comprising:
a silicon film to provide a channel to a plurality of charge storage transistors in a NOT AND (NAND) string;
a first charge storage structure at least partially surrounding the silicon film at a first location;
a second charge storage structure at least partially surrounding the silicon film at a second location; and
a dielectric between the first charge storage structure and the silicon film, and between the second charge storage structure and the silicon film, wherein a first one of the charge storage transistors comprises the first charge storage structure and at least a portion of a first word line, and wherein a second one of the charge storage transistors comprises the second charge storage structure and at least a portion of a second word line.
2. The apparatus of claim 1 , wherein the silicon film is about 3 to about 15 nanometers thick.
3. The apparatus of claim 1 , wherein the first word line is conductive and at least partially surrounding the first charge storage structure.
4. The apparatus of claim 3 , further comprising an inter-gate dielectric (IGD) between the first charge storage structure and the first word line.
5. The apparatus of claim 1 , wherein the dielectric comprises a tunneling dielectric.
6. The apparatus of claim 1 , wherein a cross-section of the silicon film is U-shaped.
7. The apparatus of claim 5 , further comprising an isolation dielectric between the first charge storage structure and the second charge storage structure.
8. The apparatus of claim 1 , wherein the first charge storage structure comprises a ring of doped polysilicon around the silicon film at the first location.
9. The apparatus of claim 8 , wherein the dielectric comprises a tunneling dielectric, and further comprises an inter-gate dielectric (IGD) at least partially surrounding the ring of doped polysilicon.
10. The apparatus of claim 9 , wherein the first word line is at least partially surrounding the ring of doped polysilicon, wherein the IGD is between the first word line and the ring of doped polysilicon.
11. An apparatus comprising:
a silicon film extending through an opening in a pair of first dielectrics to provide a channel to a plurality of charge storage transistors in a NOT AND (NAND) string;
a polysilicon gate at least partially surrounding the silicon film between the pair of first dielectrics;
a second dielectric between the polysilicon gate and the silicon film; and
a third dielectric between the polysilicon gate and a control gate.
12. The apparatus of claim 11 , wherein:
the pair of first dielectrics comprise a pair of tiers of silicon dioxide;
the second dielectric comprises silicon dioxide or silicon nitride; and
the third dielectric comprises silicon dioxide, silicon nitride and silicon dioxide.
13. The apparatus of claim 11 , wherein the silicon film is about 3 to about 15 nanometers thick.
14. The apparatus of claim 11 , wherein the polysilicon gate comprises p-type polysilicon, n-type polysilicon, or undoped polysilicon.
15. An apparatus comprising:
a silicon film to provide a channel to a plurality of charge storage transistors in a NOT AND (NAND) string;
a first charge storage structure at least partially surrounding the silicon film at a first location;
a second charge storage structure at least partially surrounding the silicon film at a second location;
a first dielectric between the first charge storage structure and the second charge storage structure; and
a second dielectric between the first charge storage structure and the silicon film, and between the second charge storage structure and the silicon film, wherein a first one of the charge storage transistors comprises the first charge storage structure and at least a portion of a first word line, and wherein a second one of the charge storage transistors comprises the second charge storage structure and at least a portion of a second word line.
16. The apparatus of claim 15 , wherein the first dielectric comprises an isolation dielectric.
17. The apparatus of claim 15 , wherein the silicon film is about 3 to about 15 nanometers thick.
18. The apparatus of claim 15 , wherein the second dielectric comprises a tunneling dielectric.
19. The apparatus of claim 15 , wherein the first charge storage structure comprises a ring of doped polysilicon around the silicon film at the first location.
20. An apparatus comprising:
a silicon film less than about 15 nanometers thick to provide a channel to a plurality of charge storage transistors in a NOT AND (NAND) string;
a first charge storage structure at least partially surrounding the silicon film at a first location;
a second charge storage structure at least partially surrounding the silicon film at a second location; and
a dielectric between the first charge storage structure and the silicon film, and between the second charge storage structure and the silicon film.
21. The apparatus of claim 20 , wherein:
the silicon film is about 3 to about 15 nanometers thick;
a first one of the charge storage transistors comprises the first charge storage structure and at least a portion of a first word line; and
a second one of the charge storage transistors comprises the second charge storage structure and at least a portion of a second word line.
22. The apparatus of claim 20 , wherein the first charge storage structure comprises a ring of doped polysilicon around the silicon film at the first location.
23. The apparatus of claim 22 , wherein the dielectric comprises a tunneling dielectric, and further comprises an inter-gate dielectric (IGD) at least partially surrounding the ring of doped polysilicon.
24. The apparatus of claim 23 , further comprising a conductive word line at least partially surrounding the ring of doped polysilicon, wherein the IGD is between the word line and the ring of doped polysilicon.