METHOD AND SYSTEM FOR THERMAL TREATMENT OF SUBSTRATES
A rapid temperature change (RTC) system includes a bake plate assembly including a heat spreader; a heater substrate coupled to the heat spreader; and a heater layer coupled to the heater substrate. The RTC system also includes a passive chill structure positioned adjacent the bake plate assembly. The passive chill structure is moveable to make physical contact with the heater layer. The passive chill structure includes a chill plate and a thermal pad coupled to the chill plate. The RTC system further includes an active chill structure positioned adjacent the passive chill structure. The passive chill structure is moveable to make physical contact with the active chill structure.
1 . A rapid temperature change (RTC) system comprising:
a bake plate assembly comprising:
a heat spreader;
a heater substrate coupled to the heat spreader; and
a heater layer coupled to the heater substrate;
a passive chill structure positioned adjacent the bake plate assembly, wherein the passive chill structure is moveable to make physical contact with the heater layer, the passive chill structure comprising:
a chill plate; and
a thermal pad coupled to the chill plate; and
an active chill structure positioned adjacent the passive chill structure, wherein the passive chill structure is moveable to make physical contact with the active chill structure.
2 . The RTC system of claim 1 wherein the bake plate assembly further comprises a vacuum pad coupled to the heat spreader.
3 . The RTC system of claim 2 wherein the vacuum pad is coupled to the heat spreader via a vacuum assist.
4 . The RTC system of claim 1 wherein the heat spreader comprises a plate containing at least copper or aluminum and having plate having a thickness between about 5 mm and 10 mm.
5 . The RTC system of claim 1 wherein the heater substrate comprises a plate containing alumina and having a thickness between about 2 mm and 5 mm.
6 . The RTC system of claim 1 further comprising a bake plate vacuum system, wherein the heat spreader and the heater substrate are coupled using the bake plate vacuum assist.
7 . The RTC system of claim 1 wherein the thermal pad is coupled to the chill plate using a vacuum assist.
8 . The RTC system of claim 1 wherein the thermal pad is coupled to the chill plate using a bonding agent.
9 . The RTC system of claim 1 wherein the passive chill structure is positioned between the active chill structure and the bake plate assembly.
10 . The RTC system of claim 1 wherein the heater layer comprises a plurality of independently controlled zones.
11 . The RTC system of claim 10 wherein one of the plurality of independently controlled zones comprises a zone overlapping with others of the plurality of independently controlled zones.
12 . The RTC system of claim 11 wherein the one of the plurality of independently controlled zones is characterized by a thermal output greater than the others of the plurality of independently controlled zones.