IP Library Granted Patent US 8,493,357
Granted Patent B2
US 8,493,357 · App. 13/041,173 · Granted Jul 23, 2013

Mechanical means for providing haptic feedback in connection with capacitive sensing mechanisms

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Quick Facts
Patent No.
US 8,493,357
App. No.
13/041,173
Granted
Jul 23, 2013
Kind
B2
Abstract

Method and apparatus for providing haptic feedback in connection with a capacitive sensing mechanism are described. In one embodiment, the apparatus comprises a convex, non-metallic structure arranged so as to maintain physical separation between an activator and the capacitive sensing mechanism until sufficient force is applied by the activator. The structure does not form a part of an electrical circuit comprising the capacitive sensing mechanism.

Claims (20)

1. Apparatus for providing haptic feedback in connection with a capacitive sensing mechanism, the apparatus comprising a convex, non-metallic structure arranged between components of the capacitive sensing mechanism so as to maintain a distance between an activation means and a component of the capacitive sensing mechanism until sufficient force is applied by the activation means, wherein the structure does not form a part of an electrical circuit comprising the capacitive sensing mechanism.

2. The apparatus of claim 1 wherein the structure is dome-shaped.

3. The apparatus of claim 1 wherein the structure comprises non-metalized plastic.

4. The apparatus of claim 1 wherein the structure comprises a tube.

5. The apparatus of claim 1 wherein the structure comprises a plastic tube having deformable material disposed therein.

6. The apparatus of claim 1 wherein the structure comprises a plastic sheet including a plurality of bubbles and wherein the plastic sheet is arranged such that each of the plastic bubbles overlies one of a plurality of touch areas of the capacitive sensing mechanism.

7. The apparatus of claim 1 wherein a switching threshold of the capacitive sensing mechanism is adjustable by a user.

8. Method for providing haptic feedback in connection with a capacitive sensing mechanism disposed in an electronic device, the method comprising arranging a non-metallic structure between components of the capacitive sensing mechanism in such manner as to maintain a distance between an activation means and a component of the capacitive sensing mechanism until sufficient force is applied with the activation means, wherein the structure does not form a part of an electrical circuit comprising the capacitive sensing mechanism.

9. The method of claim 8 wherein the structure is dome-shaped.

10. The method of claim 8 wherein the structure comprises non-metalized plastic.

11. The method of claim 8 wherein the structure comprises a tube.

12. The method of claim 8 wherein the structure comprises a tube having deformable material disposed therein.

13. The method of claim 8 wherein the structure comprises a plastic sheet including a plurality of bubbles and wherein the plastic sheet is arranged such that each of the plastic bubbles overlies one of a plurality of touch areas of the capacitive sensing mechanism.

14. An electronic device comprising a printed circuit board (“PCB”) and an input device associated with the PCB, the input device including a capacitive sensing mechanism and a haptic feedback structure associated with the capacitive sensing mechanism, the haptic feedback structure providing a physical barrier between components of the capacitive sensing mechanism for preventing a touch to be detected by the capacitive sensing mechanism until sufficient force is applied with the activation means, wherein the structure does not form a part of an electrical circuit comprising the capacitive sensing mechanism.

15. The electronic device of claim 14 wherein the structure is dome-shaped.

16. The electronic device of claim 14 wherein the structure comprises non-metalized plastic.

17. The electronic device of claim 14 wherein the structure comprises a tube.

18. The electronic device of claim 14 wherein the structure comprises a plastic tube having deformable material disposed therein.

19. The electronic device of claim 14 wherein the structure comprises a plastic sheet including a plurality of bubbles and wherein the plastic sheet is arranged such that each of the plastic bubbles overlies one of a plurality of touch areas of the capacitive sensing mechanism.

20. The electronic device of claim 14 wherein the activation means comprises a finger or a stylus.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 29, 2019
From: JPMORGAN CHASE BANK, N.A.
To: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; CHIPX, INCORPORATED; ENDWAVE CORPORATION; MAGNUM SEMICONDUCTOR, INC.
Reel/Frame 048746/0001 →
SECURITY AGREEMENT Recorded Apr 5, 2017
From: INTEGRATED DEVICE TECHNOLOGY, INC.; GIGPEAK, INC.; MAGNUM SEMICONDUCTOR, INC.; ENDWAVE CORPORATION; CHIPX, INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 042166/0431 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2011
From: MCCRACKEN, DAVID
To: INTEGRATED DEVICE TECHNOLOGY, INC.
Reel/Frame 025905/0643 →