Process for fabricating a multilayer structure with post-grinding trimming
View Patent ↗The invention relates to a process for fabricating a multilayer structure comprising: bonding a first wafer onto a second wafer, at least the first wafer having a chamfered edge; and thinning the first wafer so as to form in a transferred layer, the thinning comprising a grinding step and a chemical etching step. After the grinding step and before the chemical etching step, a trimming step of the edge of the first wafer is carried out using a grinding wheel, the working surface of which comprises grit particles having an average size of less than or equal to 800-mesh or greater than or equal to 18 microns, the trimming step being carried out to a defined depth in the first wafer so as to leave a thickness of the first wafer of less than or equal to 35 μm in the trimmed region.
1. A method of fabricating a multilayer structure, comprising:
bonding a first wafer onto a second wafer, at least the first wafer having a chamfered edge; and
thinning the first wafer to form a transferred layer, thinning the first wafer comprising:
grinding an exposed side of the first wafer;
after grinding the exposed side of the first wafer, trimming an edge of the first wafer using a grinding wheel having a working surface comprising grit particles having an average size of greater than or equal to 18 microns, trimming the edge comprising trimming the edge to a defined depth in the first wafer and leaving a portion of the edge of the first wafer having a thickness of less than or equal to 35 μm; and
chemically etching the first wafer after trimming the edge of the first wafer.
2. The method of claim 1 , wherein trimming the edge of the first wafer comprises trimming at least a portion of the first wafer having a width equal to a width over which the chamfered edge extends.
3. The method of claim 2 , wherein trimming the at least a portion of the first wafer further comprises trimming at least a portion of the first wafer having a width between 2 mm and 8 mm.
4. The method of claim 1 , further comprising selecting the first wafer to comprise at least one of a silicon wafer and an SOI structure.
5. The method of claim 1 , further comprising forming an oxide layer on the first wafer prior to bonding the first wafer onto the second wafer.
6. The method of claim 1 , wherein trimming the edge of the first wafer further comprises trimming a flank in the first wafer at an angle of about 45° to a plane of the first wafer.
7. The method of claim 1 , further comprising selecting the first wafer to comprise a plurality of components.
8. The method of claim 1 , further comprising selecting the second wafer to comprise a sapphire wafer.
9. The method of claim 1 , further comprising selecting the second wafer to comprise a silicon wafer.
10. The method of claim 9 , further comprising forming an oxide layer on the second wafer prior to bonding the first wafer onto the second wafer.
11. The method of claim 1 , further comprising forming a first plurality of components on a first side of the first wafer prior to bonding the first wafer onto the second wafer, and wherein bonding the first wafer onto the second wafer comprises bonding the first side of the first wafer to the second wafer.
12. The method of claim 11 , further comprising forming additional components on a second side of the first wafer opposite from the first side of the first wafer.
13. The method of claim 11 , further comprising selecting the first plurality of components to comprise image sensors.
14. A method of fabricating a multilayer structure, comprising:
bonding a first wafer onto a second wafer, at least the first wafer having a chamfered edge extending at least partially around a periphery of the first wafer; and
thinning the first wafer to form a transferred layer, thinning the first wafer comprising:
removing material from a surface of the first wafer on a side thereof opposite the second wafer;
grinding the periphery of the first wafer to form a thinner portion of the first wafer proximate the periphery of the first wafer; and
removing the thinner portion of the first wafer using a chemical etching process.
15. The method of claim 14 , wherein bonding the first wafer onto the second wafer comprises directly bonding the first wafer to the second wafer.
16. The method of claim 15 , wherein directly bonding the first wafer to the second wafer comprises directly bonding the first wafer to the second wafer at about 450° C. or less.
17. The method of claim 15 , wherein directly bonding the first wafer to the second wafer comprises establishing a bond energy between the first wafer and the second wafer of 1 J/m 2 or less.
18. The method of claim 16 , further comprising forming the thinner portion of the first wafer to have a thickness of about 35 microns or less.
19. The method of claim 18 , further comprising forming the thinner portion of the first wafer to have a thickness of about 10 microns or more.
20. The method of claim 19 , further comprising forming cracks in the thinner portion of the first wafer.
21. The method of claim 20 , wherein grinding the periphery of the first wafer to form the thinner portion comprises grinding the periphery of the first wafer with a grinding wheel having a working surface comprising grit particles having an average size of greater than or equal to 18 microns.
22. The method of claim 19 , further comprising forming the thinner portion of the first wafer to have a width between about 2 mm and about 10 mm.