METHODS TO FABRICATE A PHOTOACTIVE SUBSTRATE SUITABLE FOR MICROFABRICATION

1 . A method to fabricate a device for electrical conduction comprising the steps of:

providing a photosensitive glass substrate comprising one or more apertures extending from a first surface to a second surface, wherein the photosensitive glass substrate comprises at least silica, lithium oxide, aluminum oxide, and cerium oxide;

forming at least one conductive layer over the first surface, the second surface and within the one or more apertures; and

covering a portion of the at least one conductive layer to define at least one conductive element extending over a portion of at least one of the first surface and the second surface.

2 . The method of claim 1 , further comprising one or more exposed portions of the at least one conductive layer.

3 . The method of claim 1 , further comprising the step of depositing a second conductive layer of a metal on the one or more exposed portions of the at least one conductive layer within the at least one aperture.

4 . The method of claim 1 , wherein the at least one conductive layer comprises Cu, Ni, Pt, Pd, Au, Ag, Cr, NiCr, Zn, Ti, W, Sn, PdSn, a conductive polymer or combinations thereof.

5 . The method of claim 1 , wherein forming the at least one conductive layer comprises forming a metal layer by electroless or electrolytic plating of the at least one substrate blank.

6 . The method of claim 1 , further comprising the step of depositing a second conductive layer of a metal on the at least one conductive layer.

7 . The method of claim 1 , wherein the at least one conductive element includes at least one conductive trace in communication with the one or more apertures and extending over at least one of the first surface, the second surface or both surfaces.

8 . The method of claim 1 , further comprising terminating the at least one conductive trace in a conductive pad.

9 . The method of claim 8 , further comprising forming a discrete conductive element on the exposed at least a portion of the conductive pad.

10 . The method of claim 1 , further comprising forming the discrete conductive element as a solder ball.

11 . A photosensitive glass substrate for electrical conduction comprising:

a photosensitive glass substrate comprising one or more apertures extending from a first surface to a second surface, wherein the photosensitive glass substrate comprises at least silica, lithium oxide, aluminum oxide, and cerium oxide;

at least one conductive layer over at least a portion of the first surface, the second surface and within the one or more apertures;

at least one conductive element in contact with a portion of at least one of the first surface and the second surface.

12 . The photosensitive glass substrate of claim 11 , further comprising one or more exposed portions of the at least one conductive layer.

13 . The photosensitive glass substrate of claim 11 , further comprising a second conductive layer positioned on the one or more exposed portions of the at least one conductive layer within the at least one aperture.

14 . The photosensitive glass substrate of claim 11 , wherein the at least one conductive element includes at least one conductive trace in communication with the one or more apertures and extending over at least one of the first surface, the second surface or both surfaces.

15 . The photosensitive glass substrate of claim 11 , further comprising terminating the at least one conductive trace in a conductive pad.

16 . A method of fabricating a glass interposer comprising the steps of:

forming a photosensitive glass substrate comprising the steps of preparing a photosensitive glass substrate comprising at least silica, lithium oxide, aluminum oxide, and cerium oxide, masking a design layout comprising one or more holes to form one or more electrical conduction paths on the photosensitive glass substrate, exposing at least one portion of the photosensitive glass substrate to an activating energy source, exposing the photosensitive glass substrate to a heating phase of at least ten minutes above its glass transition temperature, cooling the photosensitive glass substrate to transform at least part of the exposed glass to a crystalline material to form a glass-crystalline substrate and etching the glass-crystalline substrate with an etchant solution to form the one or more depressions or through holes for electrical conduction in the device;

forming at least one conductive layer over the first surface, the second surface and within the one or more apertures; and

covering a portion of the at least one conductive layer to define at least one conductive element extending over a portion of at least one of the first surface and the second surface.

17 . A photosensitive glass interposer comprising:

a photosensitive glass substrate comprising one or more apertures extending from a first surface to a second surface, wherein the photosensitive glass substrate comprises at least silica, lithium oxide, aluminum oxide, and cerium oxide;

at least one conductive layer over at least a portion of the first surface, the second surface and within the one or more apertures;

at least one conductive element in contact with a portion of at least one of the first surface and the second surface.

18 . The photosensitive glass interposer of claim 17 , further comprising one or more exposed portions of the at least one conductive layer.

19 . The photosensitive glass interposer of claim 17 , further comprising a second conductive layer positioned on the one or more exposed portions of the at least one conductive layer within the at least one aperture.

20 . The photosensitive glass interposer of claim 17 , wherein the at least one conductive element includes at least one conductive trace in communication with the one or more apertures and extending over at least one of the first surface, the second surface or both surfaces.

21 . The photosensitive glass interposer of claim 17 , further comprising terminating the at least one conductive trace in a conductive pad.