LDMOS with improved breakdown voltage

1. A method comprising:

forming a first well and a second well in a substrate, the second well surrounding the first well;

doping the first well with a first conductivity type dopant and the second well with a second conductivity type dopant;

forming one source in the first well and one drain in the second well;

forming a doped region of the first conductivity type dopant in the first well, the doped region functioning as a body contact to the first well;

forming first and second coplanar gate stacks on the substrate, a major portion of the first gate stack being formed over a portion of the first well and the second gate stack being formed over a portion of the second well, but not over the first well; and

tuning the work functions of the first and second gate stacks to obtain a higher work function for the second gate stack than for the first gate stack,

wherein the one source and the one drain are each associated with both the first and second coplanar gate stacks.

2. The method according to claim 1 , comprising tuning the work functions by:

forming a high-k dielectric layer and a metal gate as the first gate stack; and

forming an oxide layer and a polysilicon or amorphous silicon (a-Si) field plate as the second gate stack.

3. The method according to claim 1 , comprising tuning the work functions by:

forming an oxide layer on the substrate over the portion of the first well and the portion of the second well; and

forming a first gate material on the oxide layer over the portion of the first well and a second gate material on the oxide layer over the portion of the second well, the second gate material having a higher work function than the first gate material.

4. The method according to claim 1 , comprising tuning the work functions by:

forming the first gate stack with a first dielectric layer and a metal gate, the first dielectric layer having a first work function; and

forming the second gate stack with a second dielectric layer and a metal gate, the second dielectric having a second work function different from the first work function, and the first gate stack being separated from the second gate stack.

5. The method according to claim 2 , comprising:

forming an oxide layer over the portion of the first well and the portion of the second well;

forming a polysilicon or an a-Si layer on the oxide layer;

forming an interlayer dielectric on the substrate surrounding the oxide layer and polysilicon or a-Si layer;

removing the polysilicon or a-Si layer and the oxide layer over the portion of the first well, but not over the portion of the second well, forming a cavity over the portion of the first well;

depositing the high-k dielectric or an oxide layer followed by the high-k dielectric in the cavity; and

depositing a metal on the high-k dielectric.

6. The method according to claim 3 , comprising:

forming a polysilicon layer on the entire oxide layer;

implanting an n+ dopant in the polysilicon over the portion of the first well, to form the first gate material; and

implanting a p+ dopant in the polysilicon over the portion of the second well, to form the second gate material.

7. The method according to claim 3 , comprising:

forming an undoped, p-doped, or n-doped polysilicon layer on the entire oxide layer;

implanting antimony (Sb) in the polysilicon over the portion of the first well, to form the first gate material, the undoped, p-doped, or n-doped polysilicon forming the second gate material.

8. The method according to claim 4 , comprising:

forming first and second dummy gate stacks on the substrate over the portions of the first well and the second well, respectively;

forming an interlayer dielectric (ILD) over the entire substrate;

removing the first and second dummy gate stacks, forming first and second cavities, respectively;

forming the first dielectric layer or an oxide layer followed by the first dielectric layer in the first cavity;

forming the second dielectric layer or an oxide layer followed by the second dielectric layer in the second cavity; and

forming a metal gate on each of the first and second dielectric layers.

9. The method according to claim 5 , comprising forming a p+ doped a-Si layer on the oxide layer.

10. The method according to claim 8 , comprising forming the first and second dielectric layers by:

depositing the same dielectric layer in the first and second cavities;

implanting a first dopant in the dielectric layer in the first cavity; and

implanting a second dopant in the dielectric layer in the second cavity, the second dopant being different from the first dopant.

11. The method according to claim 9 , further comprising independently biasing the field plate.

12. A method comprising:

forming a lateral diffused MOS (LDMOS) by:

forming a first well and a second well in a substrate, the second well surrounding the first well;

doping the first well with a p-type dopant and the second well with an n-type dopant;

forming one source in the first well and one drain in the second well; and

forming a p-doped region in the first well, the p-doped region functioning as a body contact to the first well;

forming a first gate stack on the substrate, a major portion of the first gate stack being formed over a portion of the first well;

forming a second gate stack on the substrate over a portion of the second well, and not over the first well, the first and second gate stacks being coplanar and being formed with different gate dielectric layers and/or with different gate electrodes, and the second gate stack having a higher work function than the first gate stack,

wherein the one source and the one drain are each associated with both the first and second gate stacks.