IP Library Granted Patent US 8,304,261
Granted Patent B2
US 8,304,261 · App. 13/048,039 · Granted Nov 6, 2012

Thermal treatment apparatus, thermal treatment method and method of manufacturing semiconductor device

Assignee: Fujitsu Semiconductor Limited
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Quick Facts
Patent No.
US 8,304,261
App. No.
13/048,039
Granted
Nov 6, 2012
Kind
B2
Abstract

A thermal treatment apparatus having a first light source emitting a first light having light diffusion property, a reflectance measuring unit irradiating a treatment target with the light from plural directions by the first light source and determining a light reflectance of the treatment target, a light irradiation controller adjusting an intensity of a second light of a second light source on the basis of the light reflectance, the second light has diffusion property, and a thermal treatment unit irradiating the treatment target with the second light having adjusted the intensity of the second light by the light irradiation controller.

Claims (16)

1. A thermal treatment apparatus comprising:

a first light source emitting a first light having light diffusion property;

a reflectance measuring unit irradiating a treatment target with the light from plural directions by the first light source and determining a light reflectance of the treatment target;

a light irradiation controller capable of adjusting an intensity of a second light of a second light source on the basis of the light reflectance, the second light has diffusion property; and

a thermal treatment unit capable of irradiating the treatment target with the second light having adjusted the intensity of the second light by the light irradiation controller.

2. The thermal treatment apparatus according to claim 1 , wherein a light intensity distribution to a light irradiation angle of the first light of the first light source is equal to a light intensity distribution to a light irradiation angle of the second light of the second light source.

3. The thermal treatment apparatus to claim 1 , wherein the reflectance measuring unit includes:

a detector detecting a reflection light which is reflected from a surface of the treatment target upon incidence of the first light of the first light source to the surface concerned and incident to a predetermined area.

4. The thermal treatment apparatus according to claim 1 , wherein a wavelength band of the first light of the first light source is equal to a wavelength band of the second light of the second light source.

5. The thermal treatment apparatus according to claim 3 , wherein the detector is an integral sphere.

6. The thermal treatment apparatus according to claim 5 , wherein the integral sphere includes:

a convex portion reflecting the first light of the first light source; and

a concave portion condensing a reflection light from the convex portion to the surface of the treatment target.

7. The thermal treatment apparatus according to claim 5 , wherein the integral sphere includes:

an incident port being freely movable interlockingly with the first light source, and the incident port allows for the first light of the first light source to pass into the integral sphere, and

wherein the detector is capable of changing a light irradiation angle of the first light of the first light source by movement of the first light source, the detector is capable of detecting reflection light at varying light irradiation angles of the first light of the first light source, the detector is capable of weighting the reflectance of the reflection light at each of the varying light irradiation angles of the first light of the first light source by a light intensity distribution at a light irradiation angle of the second light of the second light source, and the detector is capable of averaging the weighted reflectance values to determine the light reflectance of the surface of the treatment target.

Assignments (3)
CHANGE OF ADDRESS Recorded Dec 23, 2016
From: FUJITSU SEMICONDUCTOR LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 041188/0401 →
CHANGE OF NAME Recorded Sep 17, 2012
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 028995/0353 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2012
From: KUBO, TOMOHIRO
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 028946/0365 →
Priority Claims (1)
JP 2007-263720 · Oct 9, 2007 · national
Continuity (2)
Division 12246055 · Oct 6, 2008
Related Publication 20110165703A1 · Jul 7, 2011