Alignment mechanism
View Patent ↗An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.
1. A mechanism for aligning a semiconductor device and a thermal control device comprising:
a mount;
a wire having a first end affixed to the mount and a second end, the wire being at least ten times more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis,
wherein the second end of the wire is affixed to the thermal control device, the thermal control device having a surface configured to contact the semiconductor device,
wherein the wire is configured to apply a normal force component to the semiconductor device through the thermal control device and to allow movement at the second end in directions orthogonal to the normal force component,
wherein a portion of the wire is disposed within a tube, said tube being configured to prevent said portion of the wire from buckling beyond a predetermined amount to avoid buckling beyond a diameter of the tube; and
a plurality of compressible elements arranged concentrically around, and in substantially equal spaced apart relation from the wire.
2. The mechanism of claim 1 , wherein the thermal control device is a heat exchanger.
3. The mechanism of claim 2 , wherein the heat exchanger includes a fluid channel through which fluid flows, wherein the fluid assists in regulating the temperature of the semiconductor device while the surface of the heat exchanger is in contact with the semiconductor device.
4. The mechanism of claim 3 , wherein the fluid channel runs through a heat sink, and the heat exchanger further includes a heater element disposed between the heat sink and the surface of the heat exchanger that contacts the device.
5. The mechanism of claim 4 , wherein the semiconductor device is a device under test, and the heat exchanger is configured to maintain the semiconductor device at or near a setpoint temperature.
6. The mechanism of claim 5 , wherein the mount is coupled to a housing that is affixed to a handler device, the handler device being configured to: receive the semiconductor device, present the device to a test unit for testing and remove the device from the test unit after testing.
7. The mechanism of claim 1 , wherein the mount is coupled to a housing via a piston configured to provide a force in the direction of the normal force component, so as to move the thermal control device in contact with the semiconductor device.
8. The mechanism of claim 7 , wherein the mount is attached to a frame, said frame including a stop member configured to prevent displacement of the thermal control device beyond a predetermined distance in a direction orthogonal to the normal force component.
9. The mechanism of claim 3 , wherein a liquid is supplied to and received from the fluid channel via compressible inlet bellows and compressible outlet bellows, said inlet and outlet bellows each having a longitudinal axis substantially parallel to the longitudinal axis of said wire.
10. The mechanism of claim 1 , wherein the wire is configured to support and lift the thermal control device.
11. The mechanism of claim 9 , wherein the inlet bellows and the outlet bellows are disposed symmetrically at substantially equal distances from the longitudinal axis of the wire.
12. The mechanism of claim 1 , wherein the thermal control device includes an air cooled heat sink.
13. The mechanism of claim 3 , wherein the thermal control device includes an evaporator.
14. A mechanism for aligning a semiconductor device and a thermal control device comprising:
a mount;
a wire having a first end affixed to the mount and a second end, the wire requiring less than one tenth the amount of force required to provide a longitudinal displacement of the second end in order to provide a lateral bending displacement of the second end of equal magnitude to the longitudinal displacement,
wherein the second end of the wire is affixed to the thermal control device, the thermal control device having a surface configured to contact the semiconductor device,
wherein the wire is configured to apply a normal force component to the semiconductor device through the thermal control device and to allow movement at the second end in directions orthogonal to the normal force component,
wherein a portion of the wire is disposed within a tube, said tube being configured to prevent said portion of the wire from buckling beyond a predetermined amount to avoid buckling beyond a diameter of the tube; and
a plurality of compressible elements arranged concentrically around, and in substantially equal spaced apart relation from the wire.
15. The mechanism of claim 14 , wherein the wire requires less than one hundredth the amount of force required to provide a longitudinal displacement of the second end in order to provide a lateral bending displacement of the second end of equal magnitude to the longitudinal displacement.
16. The mechanism of claim 14 , wherein the thermal control device is a heat exchanger that includes a fluid channel through which fluid flows, wherein the fluid assists in regulating the temperature of the semiconductor device while the surface of the heat exchanger is in contact with the semiconductor device, wherein the fluid channel runs through a heat sink, and the heat exchanger further includes a heater element disposed between the heat sink and the surface of the heat exchanger that contacts the device, wherein the thermal control device includes an evaporator.
17. The mechanism of claim 14 , wherein the wire is longer than the tube such that a portion of the wire extending beyond the tube is less restricted and is bendable while the wire is within the tube.
18. The mechanism of claim 14 , wherein at least one of the first end and the second end of the wire extends beyond the tube such that at least one of the first end and the second end is bendable while the wire is within the tube.
19. The mechanism of claim 1 , wherein the wire is longer than the tube such that a portion of the wire extending beyond the tube is less restricted and is bendable while the wire is within the tube.
20. The mechanism of claim 1 , wherein at least one of the first end and the second end of the wire extends beyond the tube such that at least one of the first end and the second end is bendable while the wire is within the tube.
21. The mechanism of claim 1 , wherein the compressible elements are substantially parallel to the longitudinal axis of the wire.
22. The mechanism of claim 1 , wherein the compressible elements are fluid bellows.