Method and apparatus to reset a phase change memory and switch (PCMS) memory cell
View Patent ↗The present disclosure relates to the fabrication of non-volatile memory devices. In at least one embodiment, the non-volatile memory of the present disclosure may include a phase change memory and switch (hereinafter “PCMS”) memory cell and a process for resetting the PCMS memory utilizing a “look-up” table to calculate a current required to place a bit above a reference level to maximum threshold voltage.
1. A method comprising:
incrementally increasing a programming current to a memory cell until a threshold voltage resulting from the incremented programming current is greater or equal to a reference minimum threshold voltage;
assigning the programming current to be an initial current when the threshold voltage is greater or equal to the reference minimum threshold voltage;
determining a final placement programming current value from a look-up based on the value of the initial current; and
resetting the memory cell with the final placement programming current.
2. The method of claim 1 , wherein incrementally increasing the programming current comprises:
applying a programming current to a memory cell;
measuring a resulting threshold voltage from the memory cell;
comparing the measured threshold voltage to a reference minimum threshold voltage; and
incrementally increasing the programming current and repeatedly applying the programming current to the memory cell, measuring the resulting threshold voltage, and comparing the resulting threshold voltage, until the resulting threshold voltage is greater or equal to a reference minimum threshold voltage.
3. The method of claim 1 , wherein incrementally increasing a programming current to a memory cell comprises incrementally increasing a programming current to a phase change memory and switch (PCMS) memory cell until a threshold voltage resulting from the incremented programming current is greater or equal to a reference minimum threshold voltage.
4. The method of claim 1 , wherein determining a final placement programming current value from a look-up table comprises determining a final placement programming current from a look-up table of a correlation of a predicted programming current needed to substantially result in a maximum threshold voltage based on an initial current which substantially results in a minimum threshold voltage, wherein the look-up table is generated from actual data from a the memory cell.
5. The method of claim 1 , wherein determining a final placement programming current value from a look-up table comprises determining a final placement programming current from a look-up table of a correlation of a predicted programming current needed to substantially result in a maximum threshold voltage based on an initial current which substantially results in a minimum threshold voltage, wherein the look-up table is generated from an equation comprising:
V t =V t min+( E th ·L·[ 1−(( J cr ·S ) 2 /I 2 ])
where: V t is the threshold voltage
V t min is a reference minimum threshold voltage
E th is a parameter based on the phase change material used with some sensitivity to the device architecture
L is the device thickness
J cr is a parameter based on the phase change material used with some sensitivity to the device architecture
S is the device area
I is the current.
6. The method of claim 5 , wherein E th is about 3.2e5 V/cm.
7. The method of claim 5 , wherein J cr is about 1.2e7 A/cm 2 .
8. A non-volatile memory, comprising:
a phase change memory and switch (PCMS) memory cell; and
a stored look-up table accessible to reset the PCMS memory cell;
wherein the stored look-up table is a correlation of a predicted programming current needed to substantially result in a maximum threshold voltage based on an initial current which substantially results in a minimum threshold voltage, and wherein the look-up table is generated from an equation comprising:
V t =V t min+( E th ·L·[ 1−(( J cr ·S ) 2 /I 2 ])
where: V t is the threshold voltage
V t min is a reference minimum threshold voltage
E th is a parameter based on the phase change material used with some sensitivity to the device architecture
L is the device thickness
J cr is a parameter based on the phase change material used with some sensitivity to the device architecture
S is the device area
I is the current.
9. The non-volatile memory of claim 8 , wherein E th is about 3.2e5 V/cm.
10. The non-volatile memory of claim 8 , wherein J cr is about 1.2e7 A/cm 2 .
11. A system, comprising:
a controller; and
a non-volatile memory comprising a phase change memory and switch (PCMS) memory cell, and a stored look-up table accessible to reset the PCMS memory cell;
wherein the stored look-up table is a correlation of a predicted programming current needed to substantially result in a maximum threshold voltage based on an initial current which substantially results in a minimum threshold voltage, and wherein the look-up table is generated from an equation comprising:
V t =V t min+( E th ·L·[ 1−(( J cr ·S ) 2 /I 2 ])
where: V t is the threshold voltage
V t min is a reference minimum threshold voltage
E th is a parameter based on the phase change material used with some sensitivity to the device architecture
L is the device thickness
J cr is a parameter based on the phase change material used with some sensitivity to the device architecture
S is the device area
I is the current.
12. The system of claim 11 , wherein E th is about 3.2e5 V/cm.
13. The system of claim 11 , wherein J cr is about 1.2e7 A/cm 2 .