IP Library Granted Patent US 8,816,712
Granted Patent B2
US 8,816,712 · App. 13/058,158 · Granted Aug 26, 2014

Inspection device

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Quick Facts
Patent No.
US 8,816,712
App. No.
13/058,158
Granted
Aug 26, 2014
Kind
B2
Abstract

An object of the invention is to provide an inspection device which has a function of preventing electric discharge so that an absorbed current is detected more efficiently. In the invention, absorbed current detectors are mounted in a vacuum specimen chamber and capacitance of a signal wire from each probe to corresponding one of the absorbed current detectors is reduced to the order of pF so that even an absorbed current signal with a high frequency of tens of kHz or higher can be detected. Moreover, signal selectors are operated by a signal selection controller so that signal lines of a semiconductor parameters analyzer are electrically connected to the probes brought into contact with a sample. Accordingly, electrical characteristics of the sample can be measured without limitation of signal paths connected to the probes to transmission of an absorbed current. In addition, a resistance for slow leakage of electric charge is provided in each probe stage or a sample stage.

Claims (25)

1. An inspection device comprising:

an electron beam source;

an objective lens which focuses an electron beam emitted from the electron beam source on a sample;

a sample stage on which the sample is placed, the sample stage including a conductive plate for placing the sample thereon, and a plate made of an insulating material;

a plurality of probes each disposed on a respective probe stage, the plurality of probes configured to come into contact with an upper surface the sample facing the electron beam source;

a switch which selects one from: a side for grounding the conductive plate, and a side for grounding the conductive plate through a resistance, wherein:

the switch is turned to the side for grounding the conductive plate through the resistance when a wire of the sample stage comes into contact with the conductive plate,

the probe stages are positioned at sides of the sample stage, and

the probe stages and sample stage are configured to move in directions of a plurality of axes.

2. An inspection device according to claim 1 , wherein:

the resistance is higher than resistance of a wire contained in the sample.

3. An inspection device according to claim 1 , wherein:

the resistance is a variable resistance.

4. An inspection device according to any one of claim 1 , wherein:

the switch is turned to the side for grounding when the probe comes into contact with the sample.

5. An inspection device according to claim 4 , wherein:

the switch is turned to the side for grounding when the probes are brought into contact with the sample.

6. An inspection device according to claim 2 , wherein:

the resistance is a variable resistance.

7. An inspection device according to claim 2 , wherein:

the switch is turned to the side for grounding when the probe comes into contact with the sample.

8. An inspection device according to claim 3 , wherein:

the switch is turned to the side for grounding when the probe comes into contact with the sample.

9. An inspection device according to claim 6 , wherein:

the switch is turned to the side for grounding when the probe comes into contact with the sample.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2011
From: NAKAMURA, MITSUHIRO; TOYAMA, HIROSHI; NARA, YASUHIKO; OKI, KATSUO; OBUKI, TOMOHARU; SASAJIMA, MASAHIRO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 025771/0501 →