Method of crosslinking carboxyl-containing polymers using oligoamines
Oligoamines, such as a compound of the formula H 2 N(CH 2 CH 2 NH) n H in which n is an integer of 2-10, crosslink polymers containing carboxyl functionality unexpectedly faster than conventional diamines such as 1,6-diaminohexane. The combination of an ethylene-acrylic acid copolymer with an oligoamine of this type is useful for, among other things, the production of crosslinked wire and cable insulation.
1. A water-and peroxide-free process of preparing a crosslinked insulating polymer material, the process comprising:
extruding a mixture of a polymer containing carboxyl groups with at least one oligoamine onto a wire or cable, the oligoamine selected from the group consisting of
N,N′-bis(2-aminoethyl)piperazine (DAEP), and
N[(2-aminoethyl)2-aminoethyl]piperazine (PEEDA),
exposing the polymer mixture to a temperature between the melting point of the polymer and 200° C. to crosslink the polymer by amide bond formation to form a solid, crosslinked, insulating polymer material over the wire or cable,
wherein the crosslinking of said polymer occurs at a faster rate than the crosslinking of a mixture of the same polymer with an oligoamine that is not said at least one oligoamine under the same extruding and exposing conditions.
2. The process of claim 1 in which the polymer comprises between 80 and 98 percent by weight of units derived from an olefin.
3. The process of claim 2 in which the olefin is at least one of ethylene and propylene.
4. The process of claim 3 in which the polymer comprises between 2 and 20 percent by weight of units derived from (meth)acrylic acid.
5. The process of claim 1 in which the polymer is a copolymer of ethylene and acrylic acid.
6. An article made by the process of claim 1 .
7. The article of claim 6 in the form of a wire or cable sheath or an electrical junction shielding .
8. The process of claim 1 , wherein the polymer mixture is co-extruded with a jacketing layer, a semiconductor insulation layer, or both.
9. The process of claim 1 , wherein said faster rate of crosslinking is exhibited by a higher torque value (S′) in inch-pounds of the cross-linked polymer extruded with said at least one oligoamine compared to the torque value (S′) of the cross-linked polymer extruded without said at least one oligoamine.
10. The process of claim 9 , wherein said higher torque value is exhibited at 15 to 45 minutes of said exposing step.
11. A water- and peroxide-free process of preparing a crosslinked insulating polymer material, the process comprising:
extruding a mixture of a polymer containing carboxyl groups with triethylenetetramine onto a wire or cable, the triethylenetetramine being a mixture of oligoamines consisting of N,N′-bis(2-aminoethyl)-1,2-ethanediamine (L-TETA), N,N′-bis(2-aminoethyl)piperazine (DAEP), N[(2-aminoethyl)2-aminoethyl]piperazine (PEEDA) and tris-(2-aminoethyl)amine (TAEA), and
exposing the polymer mixture to a temperature between the melting point of the polymer and 200° C. to crosslink the polymer by amide bond formation to form a solid, crosslinked, insulating polymer material over the wire or cable,
wherein the crosslinking of said polymer occurs at a faster rate than the crosslinking of a mixture of the same polymer with an oligoamine that is not said triethylenetetramine under the same extruding and exposing conditions.
12. The process of claim 11 in which the polymer comprises between 80 and 98 percent by weight of units derived from an olefin.
13. The process of claim 12 in which the olefin is at least one of ethylene and propylene.
14. The process of claim 13 in which the polymer comprises between 2 and 20 percent by weight of units derived from (meth)acrylic acid.
15. The process of claim 11 in which the polymer is a copolymer of ethylene and acrylic acid.
16. An article made by the process of claim 11 .
17. The article of claim 16 in the form of a wire or cable sheath or an electrical junction shielding.
18. The process of claim 11 , wherein the polymer mixture is co-extruded with a jacketing layer, a semiconductor insulation layer, or both.