Composite free layer within magnetic tunnel junction for MRAM applications
View Patent ↗A magnetic tunneling junction (MTJ) in an MRAM array is disclosed with a composite free layer having a FL1/FL2/FL3 configuration where FL1 and FL2 are crystalline magnetic layers and FL3 is an amorphous NiFeX layer for improved bit switching performance. FL1 layer is CoFe which affords a high magnetoresistive (MR) ratio when forming an interface with a MgO tunnel barrier. FL2 is Fe to improve switching performance. NiFeX thickness where X is Hf is preferably between 20 to 40 Angstroms to substantially reduce bit line switching current and number of shorted bits. Annealing at 330° C. to 360° C. provides a high MR ratio of 190%. Furthermore, low Hc and Hk are simultaneously achieved with improved bit switching performance and fewer shorts without compromising other MTJ properties such as MR ratio. As a result of high MR ratio and lower bit-to-bit resistance variation, higher reading margin is realized.
1. A magnetic tunneling junction (MTJ) element in a magnetic device, comprising:
(a) a pinned layer formed on a substrate;
(b) a tunnel barrier layer that forms a first interface with the pinned layer; and
(c) a composite free layer consisting of a stack of three ferromagnetic layers in a FL1/FL2/FL3 configuration wherein FL1 is a first crystalline ferromagnetic layer with a first thickness that forms a second interface with the tunnel barrier layer along a surface that is opposite to the first interface, FL2 is a second crystalline ferromagnetic layer that is Fe with a second thickness substantially greater than the first thickness, and contacts a top surface of the FL1 layer, and FL3 is an amorphous NiFeX layer where X is one of Hf, Zr, Nb, Ta, or Mg and X has a content between 5 and 12 atomic % in the NiFeX layer, the amorphous NiFeX layer is the uppermost layer in the FL1/FL2/FL3 stack.
2. The MTJ element of claim 1 wherein the FL1 layer is comprised of CoFe with a Fe content between about 60 and 90 atomic % and the first thickness is about 4 to 6 Angstroms.
3. The MTJ element of claim 1 wherein the second thickness is from about 12 to 21 Angstroms.
4. The MTJ element of claim 1 wherein the amorphous NiFeX layer has a thickness between about 20 and 40 Angstroms.
5. The MTJ element of claim 1 wherein the MTJ element is comprised of a stack of layers wherein an anti-ferromagnetic (AFM) layer, the pinned layer, the tunnel barrier layer, the composite free layer, and a capping layer are sequentially formed on a seed layer.
6. The MTJ element of claim 1 wherein the tunnel barrier layer is MgO.
7. A magnetic tunneling junction (MTJ) element in a magnetic device, comprising:
(a) a composite free layer consisting of a trilayer stack with a FL3/FL2/FL1 configuration formed on a seed layer wherein FL1 is a first crystalline ferromagnetic layer with a first thickness that forms a first interface with a bottom surface of a tunnel barrier layer, FL2 is a second crystalline ferromagnetic layer that is Fe with a second thickness substantially greater than the first thickness, and contacts a bottom surface of the FL1 layer, and FL3 is an amorphous ferromagnetic NiFeX layer where X is one of Hf, Zr, Nb, Ta, or Mg and X has a content between 5 and 12 atomic % in the NiFeX layer, the amorphous NiFeX layer is the bottom layer in the FL3/FL2/FL1 stack;
(b) the tunnel barrier layer; and
(c) a pinned layer that forms an interface with a top surface of the tunnel barrier layer.
8. The MTJ element of claim 7 wherein the FL1 layer is comprised of CoFe with a Fe content between about 60 and 90 atomic % and the first thickness is about 4 to 6 Angstroms.
9. The MTJ element of claim 7 wherein the second thickness is from about 12 to 21 Angstroms.
10. The MTJ element of claim 7 wherein the amorphous NiFeX layer has a thickness between about 20 and 40 Angstroms.
11. The MTJ element of claim 7 wherein the MTJ element is comprised of a stack of layers wherein the composite free layer, the tunnel barrier layer, the pinned layer, an anti-ferromagnetic (AFM) layer, and a capping layer are sequentially formed on the seed layer.