Integrated circuit packaging system with plated leads and method of manufacture thereof
View Patent ↗An integrated circuit packaging system and method of manufacture thereof includes: an L-plated lead; a die conductively connected to the L-plated lead; and an encapsulant encapsulating the L-plated lead and the die.
1. An integrated circuit packaging system comprising:
an L-plated lead having a vertical portion extending from a horizontal portion;
wherein the vertical portion includes a horizontal surface, an inner surface and an outer surface;
wherein the horizontal portion includes an inner surface and an outer surface;
a die conductively connected to the L-plated lead;
an encapsulant encapsulating and in direct contact with the L-plated lead and the die, the encapsulant encapsulating the inner surface of the horizontal portion and the inner surface of the vertical portion but exposing the horizontal surface of the vertical portion.
2. The system as claimed in claim 1 further comprising a plated die attach paddle co-planar with a portion of the L-plated lead.
3. The system as claimed in claim 1 wherein the encapsulant exposes the outer surface of the vertical portion and the outer surface of the horizontal portion of the L-plated lead.
4. The system as claimed in claim 3 further comprising:
a first module bonded to the at least one of the horizontal surface and the outer surface of the vertical portion of the L-plated lead.
5. The system as claimed in claim 4 further comprising:
a second module bonded to the outer surface of the horizontal portion of the L-plated lead.
6. The system as claimed in claim 1 further comprising:
further L-plated leads, wherein each of the L-plated leads includes a vertical portion extending from a horizontal portion, wherein the vertical portion includes a horizontal surface, an inner surface and an outer surface, wherein the horizontal portion includes an inner surface and an outer surface; and wherein:
the die is conductively connected by wires to the L-plated leads.
7. The system as claimed in claim 6 further comprising:
a plated die attach paddle plated co-planar with portions of the L-plated leads; and wherein:
the die is attached to the plated die attach paddle.
8. The system as claimed in claim 6 wherein the encapsulant exposes the outer surface of the vertical portion and the outer surface of the horizontal portion on each of the L-plated leads.
9. The system as claimed in claim 8 further comprising:
a first module solder bonded to the at least one of the horizontal surface and the outer surface of the vertical portion on each of the L-plated leads.
10. The system as claimed in claim 9 further comprising:
a second module ball bonded to the outer surface of the horizontal portion on each of the L-plated leads.