Down-hole Cable having a Fluoropolymer Filler Layer

1 . A down-hole cable comprising:

an insulated conductor portion;

a filler layer abutting and encapsulating the insulated conductor portion, wherein the filler layer is substantially formed with a foamed fluoropolymer; and

an armor shell applied to the exterior of the foamed fluoropolymer filler layer.

2 . The down-hole cable of claim 1 , wherein the insulated conductor portion further comprises at least one conducting material surrounded by an insulated material.

3 . The down-hole cable of claim 2 , wherein the conducting material further comprises at least one of a multi-conductor, a fiber electric hybrid and a fiber optic.

4 . The down-hole cable of claim 1 , wherein the foamed fluoropolymer further comprises a gas-injected cell structure.

5 . The down-hole cable of claim 4 , wherein the gas-injected formed cell structure further comprises a nitrogen-injected cell structure.

6 . The down-hole cable of claim 1 , wherein the filler layer creates a radial compressive force acting on the insulated conductor portion and the armored shell, wherein the radial compressive force withstands a pullout force between the insulated conductor portion and the armored shell

7 . The down-hole cable of claim 6 , wherein the filler layer withstands a pullout force in a temperature greater than 150° C.

8 . The down-hole cable of claim 6 , wherein the filler layer withstands a pullout force in a temperature greater than 250° C.

9 . The down-hole cable of claim 1 , wherein the insulated conductor portion further comprises at least a first and a second conducting material, wherein the first conducting material conducts a first signal and the second conducting material conducts a second signal, distinct from the first signal.

10 . The down-hole cable of claim 1 , wherein the filler layer is constructed from at least one of fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), modified fluoroalkoxy (MFA), polyethylenetetrafluoroethylene (ETFE), a polyethylenechlorotrifluoroethylene (ECTFE), polyvinylidene fluoride (PVDF), polymethylpentene (TPX), polyether ether keytone (PEEK), copolymer and synthetic polymer.

11 . The down-hole cable of claim 1 , wherein the armor shell fully encapsulates the foamed fluoropolymer filler layer.

12 . The down-hole cable of claim 1 , wherein the armor shell further comprises at least one of a woven, solid, particulate-based and layer protection material.

13 . The down-hole cable of claim 1 , wherein the armor shell is connected to at least one anchoring structure.

14 . A method of making a down-hole cable, the method comprising the steps of:

foaming a filler layer about an insulated conductor portion, the filler layer abutting and encapsulating the insulated conductor portion wherein the filler layer is substantially a fluoropolymer; and

applying an armor shell to the exterior of the filler layer.

15 . The method of claim 14 , wherein the step of foaming the filler layer about the insulated conductor portion further comprises creating a foamed cell structure by gas-injection.

16 . The method of claim 14 , wherein foaming the filler layer about the insulated conductor portion includes creating a radial compressive force acting on the insulated conductor portion and the armored shell, wherein the radial compressive force withstands a pullout force between the insulated conductor portion and the armored shell

17 . The method of claim 16 , further comprising the step of withstanding a pullout force in a temperature greater than 150° C.

18 . The method of claim 14 , further comprising the step of transmitting at least one signal through a conducting material within the insulated conductor portion.

19 . The method of claim 14 , further comprising the step of connecting the armor shell to at least one anchoring structure.

20 . A down-hole cable comprising:

at least one elongated conducing material;

at least one insulating material fully encapsulating the at least one elongated conducting material;

a filler layer abutting and encapsulating the at least one insulating material, wherein the filler layer is substantially formed with a foamed fluoropolymer, wherein the foamed fluoropolymer includes a nitrogen-injected, foamed cell structure; and

an armor shell applied to the exterior of and fully encapsulating the foamed fluoropolymer filler layer.