Methods for rework of a solder
Methods for reworking a solder containing one or more joined members are described herein. Such methods can include applying a disintegrating agent to a solder containing a solder material, disintegrating the solder material to form a disintegrated solder material, and removing the disintegrated solder material from the solder. Such methods can also include applying a disintegrating agent containing bismuth to a solder containing a solder material, and heating the solder to liquefy the disintegrating agent. Such methods can also include applying a disintegrating agent containing a bismuth alloy to a solder having a solder material that contains metal nanoparticles, and heating the solder to liquefy the bismuth alloy.
1. A method for replacing one or more joined members by reworking a solder, the method comprising:
applying a disintegrating agent to a solder comprising a solder material;
wherein the disintegrating agent comprises bismuth;
disintegrating the solder material to form a disintegrated solder material; and
removing the disintegrated solder material from the solder.
2. The method of claim 1 , further comprising:
adding a replacement solder material to the solder so as to join a replacement member thereto.
3. The method of claim 1 , wherein the disintegrating agent comprises liquid bismuth or a liquid bismuth alloy.
4. The method of claim 1 , wherein the disintegrating agent comprises bismuth or a bismuth alloy that is liquefied following application to the solder.
5. The method of claim 4 , further comprising:
heating the solder.
6. The method of claim 1 , wherein the disintegrating agent comprises a paste, a foam, a gel, granules, a wire, or a powder.
7. The method of claim 1 , wherein the disintegrating agent comprises a bismuth alloy.
8. The method of claim 1 , wherein the solder material comprises at least one metal selected from the group consisting of copper, silver, gold and aluminum.
9. The method of claim 1 , wherein the solder material comprises copper.
10. The method of claim 9 , wherein the solder material comprises copper nanoparticles.
11. The method of claim 9 , wherein the disintegrating agent comprises a bismuth alloy.
12. The method of claim 11 , wherein the bismuth alloy comprises bismuth and tin.
13. The method of claim 12 , wherein the bismuth alloy further comprises gallium, indium, or combinations thereof
14. A method for reworking a solder comprising one or more joined members, the method comprising:
applying a disintegrating agent to a solder comprising a solder material;
wherein the disintegrating agent comprises bismuth;
heating the solder to liquefy the disintegrating agent; and
disintegrating the solder material to form a disintegrated solder material.
15. The method of claim 14 , further comprising:
disconnecting the one or more joined members;
removing the disintegrated solder material from the solder; and
adding a replacement solder material to the solder so as to join a replacement member thereto.
16. The method of claim 14 , wherein the solder material comprises copper.
17. The method of claim 16 , wherein the disintegrating agent comprises a bismuth alloy.
18. The method of claim 17 , wherein the bismuth alloy has a melting point of less than about 200° C.
19. The method of claim 17 , wherein the bismuth alloy comprises bismuth and tin.
20. The method of claim 19 , wherein the bismuth alloy further comprises gallium, indium, or combinations thereof.
21. The method of claim 14 , wherein the disintegrating agent comprises a paste, a foam, a gel, granules, a wire, or a powder.
22. A method for reworking a solder comprising one or more joined members, the method comprising:
applying a disintegrating agent to a solder comprising a solder material;
wherein the solder material comprises metal nanoparticles; and
wherein the disintegrating agent comprises a bismuth alloy;
heating the solder to liquefy the bismuth alloy; and
disintegrating the solder material to form a disintegrated solder material.
23. The method of claim 22 , wherein the liquefied bismuth alloy penetrates grain boundaries between the metal nanoparticles.
24. The method of claim 22 , further comprising:
disconnecting the one or more joined members;
removing the disintegrated solder material from the solder; and adding a replacement solder material to the solder so as to join a replacement member thereto.
25. The method of claim 22 , wherein an amount of bismuth in the bismuth alloy determines a distance that the disintegrating agent penetrates into the solder.
26. The method of claim 22 , wherein an amount of bismuth in the bismuth alloy determines a rate at which the solder material disintegrates in the presence of the liquefied disintegrating agent.
27. The method of claim 22 , wherein the metal nanoparticles comprise copper nanoparticles.
28. The method of claim 27 , wherein the copper nanoparticles are at least partially fused together in the solder.
29. The method of claim 22 , wherein the bismuth alloy has a melting point of less than about 200° C.
30. The method of claim 22 , wherein the disintegrating agent comprises a paste, a foam, a gel, granules, a wire, or a powder.
31. The method of claim 22 , wherein the bismuth alloy comprises bismuth and tin.
32. The method of claim 31 , wherein the bismuth alloy further comprises gallium, indium or combinations thereof.