Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
View Patent ↗Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.
1. A method for laser direct ablation that produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics, the method comprising:
selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece;
selecting a temporal pulsewidth for each laser pulse in a series of laser pulses;
selecting a pulse repetition frequency for the series of laser pulse, wherein the selection of the pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line, and wherein the selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line;
generating, using a laser source, a laser beam comprising the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency; and
providing relative motion between the workpiece and the laser beam such that a path of the laser beam follows the scribe line location along the surface of the workpiece at a selected velocity.
2. The method of claim 1 , wherein the selected temporal pulsewidth is less than or equal to 1 μs.
3. The method of claim 1 , wherein the selected temporal pulsewidth is in a range between about 10 ps and about 29 ns.
4. The method of claim 1 , wherein the selected velocity is in a range between about 1 m/s and about 10 m/s.
5. The method of claim 1 , wherein the selected velocity is in a range between about 2 m/s and about 4 m/s.
6. The method of claim 1 , wherein the predetermined minimum overlap of laser spots along the scribe line is about 60% of a spot size diameter.
7. The method of claim 1 , wherein the spot size diameter is in a range between about 5 μm and about 30 μm.
8. The method of claim 1 , wherein the selected pulse repetition frequency is in a range between about 750 kHz and about 5 MHz.
9. The method of claim 1 , further comprising:
determining an operating fluence of the laser source as a function of the selected temporal pulsewidth, the operating fluence comprising the selected dose fluence divided by a square root of the selected temporal pulsewidth.
10. The method of claim 9 , wherein selecting the pulse repetition frequency comprises:
scaling a maximum pulse repetition frequency of the laser source by the square root of the pulsewidth;
calculating, for the selected minimum overlap of laser spots along the scribe line, a minimum pulse repetition frequency based on a spot size and the selected velocity; and
selecting the pulse repetition frequency to be between the scaled maximum pulse repetition frequency and the calculated minimum pulse repetition frequency.
11. The method of claim 1 , further comprising:
dithering the laser beam back and forth in a dither direction while the path of the laser beam follows the scribe line location along the surface of the workpiece at the selected velocity.
12. A system for laser direct ablation that produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics, the system comprising:
a processor;
a computer-readable medium storing computer-executable instructions for causing the processor to:
select a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece;
select a temporal pulsewidth for each laser pulse in a series of laser pulses; and
select a pulse repetition frequency for the series of laser pulse, wherein the selection of the pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line, and wherein the selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line;
a laser source to generate a laser beam comprising the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency; and
motion elements to provide relative motion between the workpiece and the laser beam such that a path of the laser beam follows the scribe line location along the surface of the workpiece at a selected velocity.
13. The system of claim 12 , wherein the selected temporal pulsewidth is less than or equal to 1 μs.
14. The system of claim 12 , wherein the selected temporal pulsewidth is in a range between about 10 ps and about 29 ns.
15. The system of claim 12 , wherein the selected velocity is in a range between about 1 m/s and about 10 m/s.
16. The system of claim 12 , wherein the selected velocity is in a range between about 2 m/s and about 4 m/s.
17. The system of claim 12 , wherein the predetermined minimum overlap of laser spots along the scribe line is about 60% of a spot size diameter.
18. The system of claim 12 , wherein the spot size diameter is in a range between about 5 μm and about 30 μm.
19. The system of claim 12 , wherein the selected pulse repetition frequency is in a range between about 750 kHz and about 5 MHz.
20. The system of claim 12 , wherein the computer-executable instructions further cause the processor to:
determine an operating fluence of the laser source as a function of the selected temporal pulsewidth, the operating fluence comprising the selected dose fluence divided by a square root of the selected temporal pulsewidth.
21. The system of claim 20 , wherein the computer-executable instructions further cause the processor to select the pulse repetition frequency by:
scaling a maximum pulse repetition frequency of the laser source by the square root of the pulsewidth;
calculating, for the selected minimum overlap of laser spots along the scribe line, a minimum pulse repetition frequency based on a spot size and the selected velocity; and
selecting the pulse repetition frequency to be between the scaled maximum pulse repetition frequency and the calculated minimum pulse repetition frequency.
22. The system of claim 12 , wherein the motion elements comprise one or more galvanometers.
23. The system of claim 12 , wherein the motion elements further comprise an X-Y motion stage.
24. The system of claim 12 , further comprising:
one or more acousto-optic deflectors to dither the laser beam back and forth in a dither direction while the path of the laser beam follows the scribe line location along the surface of the workpiece at the selected velocity.