Flexible printed board and method of manufacturing same
[Object]To provide a flexible printed board improved in bendability. [Means for solving]The flexible printed board 2 comprises: an insulating substrate 21 ; a circuit wiring 22 laid on the insulating substrate 21 ; a circuit protection layer 23 laid on the circuit wiring 22 ; a shield conductive layer 24 laid on the circuit protection layer 23 ; and a shield insulating layer 25 laid on the shield conductive layer 24 , and is characterized by meeting the following Expression (1). 0.75 ≦E 2 /E 1 ≦1.29 Expression (1) Note that E 1 denotes the tensile elastic modulus of the shield conductive layer 24 and E 2 denotes the tensile elastic modulus of the shield insulating layer 25.
1. A flexible printed board comprising:
an insulating substrate;
a circuit wiring laid on the insulating substrate;
a circuit protection layer laid on the circuit wiring;
a shield conductive layer laid on the circuit protection layer; and
a shield insulating layer laid on the shield conductive layer,
wherein the following Expression (1) is satisfied.
0.75 ≦E 2 /E 1 ≦1.29 Expression (1)
where E 1 denotes tensile elastic modulus of the shield conductive layer and E 2 denotes tensile elastic modulus of the shield insulating layer,
wherein the flexible printed board is configurable to having a bend radius of 0.7 mm in a slide test and reciprocate slidingly at least 200,000 times before the circuit wiring is broken.
2. The flexible printed board as set forth in claim 1 , wherein the following Expression (2) is satisfied.
1.8 GPa≦ E 2 ≦3.1GPa Expression (2).
3. The flexible printed board as set forth in claim 2 , wherein the following Expression (4) is satisfied:
1.9[GPa]≦ E 2 ≦2.88[GPa] Expression (4).
4. The flexible printed board as set forth in claim 1 , wherein the following Expression (3) is satisfied:
0.79 ≦E 2 /E 1 ≦1.20 Expression (3).
5. The flexible printed board as set forth in claim 1 , wherein the tensile elastic modulus of the shield conductive layer and the tensile elastic modulus of the shield insulating layer are equivalent to each other.
6. The flexible printed board as set forth in claim 1 , wherein
the shield conductive layer is formed by screen-printing conductive paste on the circuit protection layer and curing the conductive paste,
the shield insulating layer is formed by screen-printing insulating ink on the shield conductive layer and curing the insulating ink,
the shield conductive layer has a first surface facing the shield insulating layer,
the first surface is concave-convex shape,
the shield insulating layer has a second surface facing the first surface of the shield conductive layer, and
the second surface has a concave-convex shape corresponding to the shape of the first surface.
7. A method of manufacturing the flexible printed board as set forth in claims 1 , comprising:
forming the shield conductive layer by screen-printing conductive paste on the circuit protection layer and curing the conductive paste; and
forming the shield insulating layer by screen-printing insulating ink on the shield conductive layer and curing the insulating ink.