Semiconductor device, method for manufacturing of semiconductor device, and switching circuit
View Patent ↗It is an objective to provide a semiconductor device with low leak current. The semiconductor device includes a plurality of ground side electrodes and a plurality of signal side electrodes arranged on a semiconductor substrate in an alternating manner; a plurality of control electrodes arranged respectively between each pair of a ground side electrode and a signal side electrode; a ground side electrode connecting section that connects the ground side electrodes to each other; a signal side electrode connecting section that connects the signal side electrodes to each other; and ground side lead wiring and signal side lead wiring that extend respectively from a region near one end and a region near another end of an arranged electrode section, in which the ground side electrodes and the signal side electrodes are arranged in an arrangement direction, away from the arranged electrode group in the arrangement direction.
1. A semiconductor device comprising:
a plurality of ground side electrodes and a plurality of signal side electrodes arranged on a semiconductor substrate in an alternating manner;
a plurality of control electrodes arranged respectively between each pair of a ground side electrode and a signal side electrode;
a ground side electrode connecting section that connects the ground side electrodes to each other;
a signal side electrode connecting section that connects the signal side electrodes to each other; and
ground side lead wiring and signal side lead wiring that extend respectively from a region near one end and a region near another end of an arranged electrode section, in which the ground side electrodes and the signal side electrodes are arranged in an arrangement direction, away from the arranged electrode group in the arrangement direction.
2. The semiconductor device according to claim 1 , wherein
the ground side lead wiring is adjacent to a ground side electrode, from among the plurality of ground side electrodes, that is closest to the ground side lead wiring, and
the signal side lead wiring is adjacent to a signal side electrode, from among the plurality of signal side electrodes, that is closest to the signal side lead wiring.
3. The semiconductor device according to claim 1 , wherein
the ground side electrode connecting section lessens concentration of electric fields in the control electrodes.
4. The semiconductor device according to claim 3 , wherein
the ground side electrode connecting section has a width greater than a width of the signal side electrode connecting section.
5. The semiconductor device according to claim 3 , wherein
the ground side electrode connecting section is formed above ends, in a width direction of the control electrodes, of the ground side electrodes, the signal side electrodes, and the control electrodes.
6. The semiconductor device according to claim 5 , wherein
the ground side electrode connecting section is formed above both ends, in the width direction of the control electrodes, of the ground side electrodes and the signal side electrodes.
7. The semiconductor device according to claim 1 , wherein
leak current per 1 mm of gate width is no greater than 500 pA, and ON resistance is no greater than 2 Ωmm.
8. A semiconductor device manufacturing method comprising:
preparing a semiconductor substrate;
forming, on the semiconductor substrate, a plurality of ground side electrodes and a plurality of signal side electrodes arranged in an alternating manner;
forming an insulating layer on a surface of the semiconductor substrate, at least in a region between each pair of a ground side electrode and a signal side electrode;
forming a plurality of control electrodes arranged on the insulating layer respectively between each pair of a ground side electrode and a signal side electrode;
forming a ground side electrode connecting section that connects the ground side electrodes to each other;
forming a signal side electrode connecting section that connects the signal side electrodes to each other; and
forming ground side lead wiring and signal side lead wiring that extend respectively from a region near one end and a region near an other end of an arranged electrode section, in which the ground side electrodes and the signal side electrodes are arranged in an arrangement direction, away from the arranged electrode group in the arrangement direction.
9. A switching circuit comprising a semiconductor device that operates as a switching element, wherein the semiconductor device includes:
a plurality of ground side electrodes and a plurality of signal side electrodes arranged on a semiconductor substrate in an alternating manner;
a plurality of control electrodes arranged respectively between each pair of a ground side electrode and a signal side electrode;
a ground side electrode connecting section that connects the ground side electrodes to each other;
a signal side electrode connecting section that connects the signal side electrodes to each other; and
ground side lead wiring and signal side lead wiring that extend respectively from a region near one end and a region near an other end of an arranged electrode section, in which the ground side electrodes and the signal side electrodes are arranged in an arrangement direction, away from the arranged electrode group in the arrangement direction.