IP Library › Granted Patent US 8,754,165
Granted Patent B2
US 8,754,165 · App. 13/084,641 · Granted Jun 17, 2014

Heat-conductive silicone grease composition

Inventors: Nobuaki Matsumoto (Annaka, JP); Ikuo Sakurai (Annaka, JP); Kunihiro Yamada (Annaka, JP); Masaya Ueno (Annaka, JP)
Assignee: Shin-Etsu Chemical Co., Ltd.
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Quick Facts
Patent No.
US 8,754,165
App. No.
13/084,641
Granted
Jun 17, 2014
Kind
B2
Abstract

A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

Claims (32)

1. A heat-conductive silicone grease composition that will increase its viscosity with moisture at room temperature, comprising

(A) 1 to 40 parts by weight of an organopolysiloxane capped with trialkoxysilyl at both ends and having a viscosity of 0.1 to 1,000 Pa·s at 25° C.,

(B) 60 to 99 parts by weight of an organopolysiloxane having the general formula (1):

wherein R 1 is each independently a substituted or unsubstituted monovalent hydrocarbon radical, R 2 is each independently an alkyl, alkoxyalkyl, alkenyl or acyl radical, n is an integer of 5 to 100, and a is an integer of 1 to 3,

the sum of components (A) and (B) being 100 parts by weight,

(C) 100 to 2,000 parts by weight of a heat-conductive filler having a heat conductivity of at least 10 W/m° C., and

(D) 0.1 to 20 parts by weight of a condensation catalyst,

wherein the viscosity of said composition as prepared is 50 to 250 Pa·s at 25° C. and wherein when said heat-conductive silicone grease composition increases its viscosity at a temperature of 23±2° C. and a relative humidity (RH) of 50±5% for 7 days, the viscosity corresponds to a hardness of 15 to 60 units as measured by an Asker hardness tester.

2. The composition of claim 1 , further comprising

(E) 0.1 to 20 parts by weight relative to 100 parts by weight of components (A) and (B) combined of an organosilane having the general formula (2):

R 3 b R 4 c Si(OR 5 ) 4-b-c   (2)

wherein R 3 is each independently an unsubstituted C 6 -C 20 alkyl radical, R 4 is each independently a substituted or unsubstituted, C 1 -C 20 monovalent hydrocarbon radical, R 5 is each independently a C 1 -C 6 alkyl radical, b is an integer of 1 to 3, c is an integer of 0 to 2, and b+c is 1 to 3, or a partial hydrolytic condensate thereof.

3. The composition of claim 1 , further comprising

(F) 0.1 to 900 parts by weight relative to 100 parts by weight of components (A) and (B) combined of an organopolysiloxane having the average compositional formula (3):

R 6 d SiO (4-d)/2   (3)

wherein R 6 is each independently a substituted or unsubstituted, C 1 -C 18 monovalent hydrocarbon radical, and d is a positive number of 1.8 to 2.2, said organopolysiloxane having a viscosity of 0.05 to 1,000 Pa·s at 25° C.

4. The heat-conductive silicone grease composition of claim 1 , wherein component (A) is an organopolysiloxane having the following formula (4):

wherein R 7 is each independently a C 1 -C 4 alkyl radical, R 8 is each independently a substituted or unsubstituted, C 1 -C 8 monovalent hydrocarbon radical, and the subscript m is such a number that the organopolysiloxane of formula (4) is have a viscosity of 0.1 to 1,000 Pa·s at 25° C.

5. The heat-conductive silicone grease composition of claim 1 , wherein, in component (B), R 1 is methyl, phenyl, or vinyl, R 2 is methyl or ethyl, n is 10 to 50, a is 3, and component (B) has a viscosity of 0.005 to 100 Pa·s at 25° C.

6. The heat-conductive silicone grease composition of claim 1 , wherein component (C) is a powder selected from the group consisting of aluminum powder, copper powder, silver powder, nickel powder, gold powder, alumina powder, zinc oxide powder, magnesium oxide powder, aluminum nitride powder, boron nitride powder, silicon nitride powder, diamond powder, carbon powder, and mixtures thereof.

7. The heat-conductive silicone grease composition of claim 1 , wherein component (D) is a member selected from the group consisting of alkyltin esters, titanic acid esters, titanium chelates, organometallic compounds, aminoalkyl-substituted alkoxysilanes, amine compounds and salts thereof, quaternary ammonium salts, alkali metal salts of lower fatty acids, dialkylhydroxylamines, guanidyl-containing silanes, guanidyl-containing siloxanes, and mixtures thereof.

8. The heat-conductive silicone grease composition of claim 2 , wherein R 3 is a C 6 -C 14 alkyl radical, R 4 is methyl, and b+c is 1.

9. The heat-conductive silicone grease composition of claim 3 , wherein R 6 is methyl, phenyl, or a C 6 -C 14 alkyl radical and d is 1.9 to 2.2.

10. The heat-conductive silicone grease composition of claim 1 , wherein:

component (A) is a dimethylpolysiloxane capped with trimethoxysilyl at both ends, having a viscosity of 1 to 200 Pa·s at 25° C.;

component (B) is a compound of formula (1)

wherein the left-most R′ moiety is methyl or vinyl and all of the remaining R 1 moieties are methyl, the R 2 moieties are methyl, the subscript a is 3, and the subscript n is 30;

component (C) is aluminum powder or zinc oxide powder with an average particle size of 1 μm to 15.0 μm; and

component (D) is diisopropoxybis(ethyl acetoacetate)titanium, said heat-conductive silicone grease composition further comprising

as a component (E), C 10 H 21 Si(OCH 3 ) 3 ; and

as a component (F), a compound of the formula

having a viscosity of 5 Pa·s at 25° C.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2011
From: MATSUMOTO, NOBUAKI; SAKURAI, IKUO; YAMADA, KUNIHIRO; UENO, MASAYA
To: SHIN-ETSU CHEMICAL CO., LTD.
Reel/Frame 026115/0394 →
Priority Claims (1)
JP 2010-091900 · Apr 13, 2010 · national
Continuity (1)
Related Publication 20110248211A1 · Oct 13, 2011