Method for producing a multiplicity of semiconductor wafers by processing a single crystal
View Patent ↗A method for producing a plurality of semiconductor wafers includes processing a single crystal. The single crystal is provided in a grown state and has a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers. A block is sliced from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers. A lateral surface of the block is ground around the crystallographic axis. A plurality of semiconductor wafers are then sliced from the ground block along cutting planes perpendicular to the crystallographic axis.
1. A method for producing a plurality of semiconductor wafers by processing a single crystal, the method comprising:
providing a single crystal in an as-grown state, the single crystal having a central longitudinal axis with an orientation that deviates from a sought orientation of a crystal lattice of the semiconductor wafers;
slicing at least one block from the single crystal along cutting planes perpendicular to a crystallographic axis corresponding to the sought orientation of the crystal lattice of the semiconductor wafers;
grinding a lateral surface of the at least one block around the crystallographic axis so as to form at least one ground block with a central longitudinal axis substantially parallel to the crystallographic axis; and
slicing a plurality of semiconductor wafers from at least one ground block along cutting planes perpendicular to the crystallographic axis.
2. The method recited in claim 1 , further comprising determining a position of the crystallographic axis using surfaces that are visible on the single crystal and that have a known orientation as reference planes.
3. The method recited in claim 1 , wherein the slicing the at least one block from the single crystal includes using a band saw.
4. The method recited in claim 1 , further comprising marking the at least one block with a mark indicating a reference direction in a plane of the semiconductor wafers.
5. The method recited in claim 1 , wherein the at least one ground block includes a first block and a second block,
further comprising arranging the first block adjacent to the second block,
and wherein the slicing the plurality of semiconductor wafers includes using a multi wire saw to slice the semiconductor wafers from the first and second block.
6. The method recited in claim 5 , further comprising adhesively bonding the first block to the second block before slicing the plurality of semiconductor wafers.
7. The method recited in claim 1 , wherein the slicing at least one block from the single crystal is carried out with the single crystal in the as-grown state.