IP Library Granted Patent US 8,610,222
Granted Patent B2
US 8,610,222 · App. 13/088,579 · Granted Dec 17, 2013

MEMS device with central anchor for stress isolation

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Quick Facts
Patent No.
US 8,610,222
App. No.
13/088,579
Granted
Dec 17, 2013
Kind
B2
Abstract

A MEMS device ( 20 ) includes a proof mass ( 32 ) coupled to and surrounding an immovable structure ( 30 ). The immovable structure ( 30 ) includes fixed fingers ( 36, 38 ) extending outwardly from a body ( 34 ) of the structure ( 30 ). The proof mass ( 32 ) includes movable fingers ( 60 ), each of which is disposed between a pair ( 62 ) of the fixed fingers ( 36, 38 ). A central area ( 42 ) of the body ( 34 ) is coupled to an underlying substrate ( 24 ), with the remainder of the immovable structure ( 30 ) and the proof mass ( 32 ) being suspended above the substrate ( 24 ) to largely isolate the MEMS device ( 20 ) from package stress, Additionally, the MEMS device ( 20 ) includes isolation trenches ( 80 ) and interconnects ( 46, 50, 64 ) so that the fixed fingers ( 36 ), the fixed fingers ( 38 ), and the movable fingers ( 60 ) are electrically isolated from one another to yield a differential device configuration.

Claims (71)

1. A microelectromechanical systems (MEMS) device comprising:

a substrate;

a first structure including a body and fixed fingers extending outwardly from an outer periphery of said body, wherein a central area of said body is coupled to said substrate and a remainder of said first structure is suspended over said substrate;

a frame structure surrounding said first structure and suspended over said substrate, said frame structure being movably coupled to said first structure, said frame structure including a movable finger extending inwardly from an inner periphery of said frame structure, said movable finger being disposed between a pair of said fixed fingers;

an anchor element extending through said body of said first structure and coupled to said substrate; and

a signal trace electrically connecting said frame structure to said anchor element, and said frame structure, said signal trace, and said anchor element being electrically isolated from said first structure.

2. A MEMS device as claimed in claim 1 wherein said pair of fixed fingers includes a first fixed finger and a second fixed finger, and said MEMS device further comprises at least one isolation trench extending through said first structure, said at least one isolation trench electrically isolating said first fixed finger from said second fixed finger.

3. A MEMS device as claimed in claim 2 wherein said anchor element is a first anchor element, said signal trace is a first signal trace, and said MEMS device further comprises:

a second anchor element extending through said body of said first structure proximate said central area and coupled to said substrate;

a second signal trace electrically connecting said first fixed finger to said second anchor element;

a third anchor element extending through said body of said first structure proximate said central area and coupled to said substrate; and

a third signal trace electrically connecting said second fixed finger to said third anchor element, wherein said third anchor element and said third signal trace are electrically isolated from said second anchor element and said second signal trace.

4. A MEMS device as claimed in claim 3 wherein:

said first structure includes multiple pairs of said fixed fingers extending outwardly from said outer periphery of said body;

said frame structure includes multiple movable fingers extending inwardly from said inner periphery of said frame structure, each of said movable fingers being disposed between one of said multiple pairs of said fixed fingers;

said second signal trace electrically connects said first finger of each of said pairs of said fixed fingers to said second anchor element; and

said third signal trace electrically connects said second finger of said each of said pairs of said fixed fingers to said third anchor element.

5. A MEMS device as claimed in claim 1 further comprising isolation trenches extending through said first structure between said body and said fixed fingers such that each of said fixed fingers is laterally anchored to one of said isolation trenches, said isolation trenches including an insulator material.

6. A MEMS device as claimed in claim 5 further comprising:

a second anchor element extending through said body proximate said central area and coupled to said substrate;

a third anchor element extending through said body proximate said central area and coupled to said substrate, said third anchor element being electrically isolated from said second anchor element;

a first electrical connection overlying at least one of said isolation trenches and electrically connecting a first finger of said pair of fixed fingers to said second anchor element; and

a second electrical connection overlying another of said isolation trenches and electrically connecting a second finger of said pair of fixed fingers to said third anchor element, said second electrical connection being electrically isolated from said first electrical connection.

7. A MEMS device as claimed in claim 1 further comprising at least one isolation trench interposed between said first structure and said frame structure, said isolation trench electrically isolating said frame structure from said first structure.

8. A MEMS device as claimed in claim 1 wherein said signal trace comprises:

a trace structure having an insulating layer and a conductive layer;

a first via at a first end of said trace structure, said first via electrically coupling said frame structure with said conductive layer; and

a second via at a second end of said trace structure, said second via electrically coupling said anchor element with said conductive layer, and said insulating layer being interposed between said first structure and said conductive layer.

9. A MEMS device as claimed in claim 1 wherein said first structure includes an aperture extending through said body, and said anchor element resides within said aperture and is sized such that a gap region is formed between outer side surfaces of said anchor element and inner side surfaces of said body.

10. A MEMS device as claimed in claim 9 further comprising a compliant member residing in said gap region and interconnected between said anchor element and said body of said first structure, said compliant member being electrically connected to each of said anchor element, and said signal trace and said compliant member being electrically isolated from said body of said first structure.

11. A MEMS device as claimed in claim 1 further comprising an isolation ring surrounding said anchor element extending through said body, said isolation ring electrically isolating said anchor element from said first structure.

12. A MEMS device as claimed in claim 1 wherein said pair of fixed fingers is a first pair of fixed fingers, said fixed fingers includes a second pair of fixed fingers, said movable finger is a first movable finger, and said frame structure further comprises:

isolation trenches extending through said frame structure to form a first mass section and a second mass section of said frame structure, said second mass section being electrically isolated from said first mass section by said isolation trenches, said first movable finger extending inwardly from said inner periphery of said first mass section; and

a second movable finger extending inwardly from said inner periphery of said second mass section, said second movable finger being disposed between said second pair of fixed fingers.

13. A microelectromechanical systems (MEMS) device comprising:

a substrate;

a first structure including a body and fixed fingers extending outwardly from an outer periphery of said body, wherein a central area of said body is coupled to said substrate and a remainder of said first structure is suspended over said substrate;

a frame structure surrounding said first structure and suspended over said substrate, said frame structure being movably coupled to said first structure, said frame structure including a movable finger extending inwardly from an inner periphery of said frame structure, said movable finger being disposed between a pair of said fixed fingers;

a plurality of isolation trenches extending through said first structure, wherein at least one of said isolation trenches electrically isolates a first fixed finger of said pair from a second fixed finger of said pair of fixed fingers, and at least another of said isolation trenches electrically isolates said frame structure from said first structure;

an anchor element extending through said body of said first structure and coupled to said substrate; and

a signal trace electrically connecting said frame structure to said anchor element, and said frame structure, said signal trace, and said anchor element being electrically isolated from said first structure.

14. A MEMS device as claimed in claim 13 wherein said anchor element is a first anchor element, said signal trace is a first signal trace, and said MEMS device further comprises:

a second anchor element extending through said body of said first structure proximate said central area and coupled to said substrate;

a second signal trace electrically connecting said first fixed finger to said second anchor element;

a third anchor element extending through said body of said first structure proximate said central area and coupled to said substrate; and

a third signal trace electrically connecting said second fixed finger to said third anchor element, wherein said third anchor element and said third signal trace are electrically isolated from said second anchor element and said second signal trace.

15. A MEMS device as claimed in claim 13 wherein said at least one of said isolation trenches extends through said first structure between said body and said fixed fingers such that each of said fixed fingers is laterally anchored to one of said isolation trenches.

16. A MEMS device as claimed in claim 13 wherein said pair of fixed fingers is a first pair of fixed fingers, said fixed fingers includes a second pair of fixed fingers, said movable finger is a first movable finger, and said frame structure further comprises:

isolation trenches extending through said frame structure to form a first mass section and a second mass section of said frame structure, said second mass section being electrically isolated from said first mass section by said isolation trenches, said first movable finger extending inwardly from said inner periphery of said first mass section; and

a second movable finger extending inwardly from said inner periphery of said second mass section, said second movable finger being disposed between said second pair of fixed fingers.

17. A MEMS device as claimed in claim 16 wherein said anchor element is a first anchor element, said signal trace is a first signal trace, and said MEMS device further comprises:

a second anchor element extending through said body of said first structure proximate said central area and coupled to said substrate;

a second signal trace electrically connecting each of said first fixed finger and a third fixed finger of said second pair of fixed fingers to said second anchor element;

a third anchor element extending through said body of said first structure proximate said central area and coupled to said substrate; and

a third signal trace electrically connecting each of said second fixed finger and a fourth fixed finger of said second pair of fixed fingers to said third anchor element, wherein said third anchor element and said third signal trace are electrically isolated from said second anchor element and said second signal trace.

18. A microelectromechanical systems (MEMS) device comprising:

a substrate;

a first structure including a body and fixed fingers extending outwardly from an outer periphery of said body, wherein a central area of said body is coupled to said substrate and a remainder of said first structure is suspended over said substrate, and said first structure further includes an aperture extending through said body;

a frame structure surrounding said first structure and suspended over said substrate, said frame structure being movably coupled to said first structure, said frame structure including a movable finger extending inwardly from an inner periphery of said frame structure, said movable finger being disposed between a pair of said fixed fingers;

an anchor element residing within said aperture and extending through said body to couple to said substrate, said anchor element being sized such that a gap region is formed between outer side surfaces of said anchor element and inner side surfaces of said body; and

a signal trace electrically connecting said frame structure to said anchor element, said signal trace including:

a trace structure having an insulating layer and a conductive layer;

a first via at a first end of said trace structure, said first via electrically coupling said frame structure with said conductive layer; and

a second via at a second end of said trace structure, said second via electrically coupling said anchor element with said conductive layer, and said insulating layer being interposed between said first structure and said conductive layer such that frame structure, said signal trace, and said anchor element are electrically isolated from said first structure.

19. A MEMS device as claimed in claim 18 further comprising a compliant member residing in said gap region and interconnected between said anchor element and said body of said first structure, said compliant member being electrically connected to each of said anchor element and said signal trace, and said compliant member being electrically isolated from said first structure.

20. A MEMS device as claimed in claim 18 wherein said anchor element is a first anchor element, said signal trace is a first signal trace, and said MEMS device further comprises:

at least one isolation trench extending through said first structure, said at least one isolation trench electrically isolating a first fixed finger from a second fixed finger of said pair of fixed fingers;

a second anchor element extending through said body of said first structure proximate said central area and coupled to said substrate;

a second signal trace electrically connecting said first fixed finger to said second anchor element;

a third anchor element extending through said body of said first structure proximate said central area and coupled to said substrate; and

a third signal trace electrically connecting said second fixed finger to said third anchor element, wherein said third anchor element and said third signal trace are electrically isolated from said second anchor element and said second signal trace.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027621/0928 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 18, 2011
From: LIN, YIZHEN; LI, GARY G.; MCNEIL, ANDREW C.; ZHANG, LISA Z.; MILLER, TODD F.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 026142/0585 →