Microstructure and microstructure manufacture method
A microstructure comprises a laminate structure having a first conductor, a second conductor, and an intervening insulator located between the first and the second conductors. The first conductor includes opposite faces in relation to the second conductor, side faces, and edge parts which form the boundaries of the aforementioned opposite faces and side faces. The second conductor includes an extended face extending beyond the edge parts exceeding the first conductor. The insulation film includes an area covering at least part of an edge part and/or at least part of a side face.
1. A method of manufacturing the microstructure formed by processing a material substrate having a laminate structure including a first conductor layer, a second conductor layer, and an intervening insulation layer located between said first and second conductor layers, comprising the steps of:
forming a first conductor having an opposite face in relation to said second conductor layer, a side face, and an edge part forming a boundary between the opposite face and the side face, wherein the first conductor is formed by anisotropic etching said first conductor layer to partially expose said intervening insulation layer, the side face, and the edge part;
forming an intervening insulator on said intervening insulation layer by isotropic etching said intervening insulation layer so etching will proceed from the portion of said intervening insulation layer which was exposed by the anisotropic etching;
forming a second conductor, having an extended face extending beyond the first conductor exceeding the edge part, formed on said second conductor layer; and
forming an insulation film having an area covering at least part of the edge part and/or covering at least part of the side face.