Image display device and the method for manufacturing the same
An image display device comprises: a first substrate having flexure property; a first resin layer which is attached to the first substrate and over which thin film transistors are located; a barrier layer which comprises an inorganic film covering a surface of the resin layer; and a first thin film layer and a second thin film layer which are located so as to sandwich the first resin layer with the barrier layer disposed therebetween.
1. A method for manufacturing an image display device, comprising:
forming a resin layer on a substrate;
forming a semiconductor element comprising thin film transistors on the resin layer;
forming grooves that are shallower than a thickness of the resin layer on an upper surface side of the resin layer;
irradiating light to the resin layer from a side of the resin layer on which the substrate exists after forming the grooves; and
separating the substrate from the resin layer on which the semiconductor element is formed;
wherein a part of the resin layer remains on bottom portions of the grooves;
wherein the resin layer comprises a first resin layer and a second resin layer;
wherein the forming the resin layer on the substrate comprises:
forming the second resin layer on the substrate;
forming a barrier layer that is formed of an inorganic material on the second resin layer; and
forming the first resin layer on the barrier layer; and
wherein the forming the grooves on the upper surface side of the resin layer comprises forming the grooves so as to penetrate through the first resin layer and the barrier layer so that the part of the second resin layer remains on the bottom portions of the grooves.
2. The method for manufacturing the image display device according to claim 1 , further comprising
cutting the image display device for at least one display region formed on a region where the semiconductor element is formed,
wherein the grooves are formed so as to overlap cutting positions.