IP Library Granted Patent US 8,521,463
Granted Patent B2
US 8,521,463 · App. 13/093,865 · Granted Aug 27, 2013

System for performing electrical characterization of asynchronous integrated circuit interfaces

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Quick Facts
Patent No.
US 8,521,463
App. No.
13/093,865
Granted
Aug 27, 2013
Kind
B2
Abstract

An integrated circuit with a single-channel input/output (I/O) interface and a multi-channel I/O interface includes functional circuits that operate in different clock domains and a test circuit. For a single-channel I/O interface, the test circuit simulates read/write operations by bypassing the functional circuits and performs electrical characterization of the single-channel I/O interface. For a multi-channel I/O interface, the test circuit configures a plurality of channels of the multi-channel interface in a half-duplex mode and performs electrical characterization using data loop back by bypassing the functional circuits.

Claims (34)

1. An integrated circuit, comprising:

a plurality of functional circuits including a first functional circuit and a second functional circuit;

a plurality of input/output (I/O) pads coupled to the plurality of functional circuits;

a plurality of single-channel I/O interfaces for performing one or more read/write operations to the integrated circuit by way of the first and second functional circuits;

a capture flip-flop for capturing data at the plurality of single-channel I/O interfaces; and

a test circuit for performing electrical characterization of the plurality of single-channel I/O interfaces, wherein the test circuit includes at least one of an address register, a command register and a data register for simulating the one or more read/write operations, and wherein the test circuit is configured for:

simulating the one or more read/write operations by way of the at least one of the address register, the command register and the data register, such that the read/write operations bypass the first and the second functional circuits, and driving data from the data register to at least one of the plurality of single-channel I/O interfaces in order to perform transmit channel electrical characterization;

configuring a first single-channel interface in an input mode for receiving test data from an external tester, capturing the test data by way of the capture flip-flop, wherein the capture flip-flop samples the test data, and driving the sampled test data to at least one of the plurality of I/O pads in order to perform receive channel electrical characterization.

2. The integrated circuit of claim 1 , wherein the test circuit further comprises a comparator for comparing the captured test data with predetermined test data to determine data accuracy.

3. The integrated circuit of claim 1 , wherein the test circuit further comprises a memory module for storing a set of pre-programmed values for simulating the one or more read/write operations.

4. The integrated circuit of claim 1 , wherein the first functional circuit operates in a first clock domain and the second functional circuit operates in a second clock domain.

5. The integrated circuit of claim 4 , further comprising a bypass clock circuit for receiving clock signals from the first and second clock domains and generating a bypass clock signal, wherein the bypass clock signal synchronizes the operations of the first and second functional circuits.

6. The integrated circuit of claim 5 , wherein the bypass clock signal drives the test circuit.

7. The integrated circuit of claim 4 , wherein a clock signal from the first clock domain drives the second functional circuit.

8. The integrated circuit of claim 1 , further comprising a launch flip-flop for driving data from the data register to the at least one of the plurality of single-channel I/O interfaces.

9. The integrated circuit of claim 1 , wherein the at least one of the plurality of single-channel I/O interfaces is a parallel in-phase and quadrature phase (PIQ) interface.

10. The integrated circuit of claim 1 , wherein the at least one of the plurality of single-channel I/O interfaces is an external memory interface.

11. An integrated circuit, comprising:

a plurality of functional circuits including a first functional circuit and a second functional circuit;

a multi-channel input/output (I/O) interface, wherein the multi-channel I/O interface comprises a plurality of channels that operate in a half-duplex mode; and

a test circuit for performing electrical characterization of each of the plurality of channels, and wherein the test circuit is configured for:

setting a first channel of the plurality of channels to a receive mode;

setting a second channel of the plurality of channels to a transmit mode;

receiving input test data at the first channel;

sampling the input test data at the first channel;

transmitting the sampled input test data to the second channel by bypassing the first and second functional circuits; and

generating output data at the second channel, thereby performing the electrical characterization of the first and second channels.

12. The integrated circuit of claim 11 , wherein the test circuit further comprises a comparator for comparing the sampled input test data with predetermined test data to determine data accuracy.

13. The integrated circuit of claim 11 , wherein the test circuit comprises a memory module for storing a set of pre-programmed values for configuring the plurality of channels in the half-duplex mode.

14. The integrated circuit of claim 11 , wherein the first functional circuit operates in a first clock domain and the second functional circuit operates in a second clock domain.

15. The integrated circuit of claim 14 , further comprising a bypass clock circuit for receiving clock signals from the first and second clock domains and generating a bypass clock signal that synchronizes the operations of the first and second functional circuits.

16. The integrated circuit of claim 15 , wherein the bypass clock signal drives the test circuit.

17. The integrated circuit of claim 15 , wherein a clock signal from the first clock domain drives the second functional circuit.

18. The integrated circuit of claim 11 , wherein the multi-channel I/O interface is a radio front-end digital, parallel interface.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027621/0928 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 26, 2011
From: JINDAL, DEEPAK; DEOGHARIA, AMAR NATH N.; GUPTA, SHYAM S.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 026178/0766 →