Chemical mechanical polishing system
The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
1. A chemical-mechanical polishing apparatus, comprising:
at least one polishing platens rotatably installed with a platen pad mounted on its upper surface;
a guide rail disposed along a predetermined path;
a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and
a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen,
wherein the path has a first path and a second path, said path including an unconnected path between the first path and the second path, wherein the substrate carrier unit is carried across the unconnected path by a carrier holder which accommodates the substrate carrier unit and moves across the unconnected path between the first path and the second path whereby the substrate carrier unit travels through the path.
2. The chemical-mechanical polishing apparatus as claimed claim 1 , wherein the substrate carrier unit does not carry neither a driving source nor an electrical power source, and wherein an air pressure supply tube is connected to the substrate carrier unit during the substrate polishing process.
3. The chemical-mechanical polishing apparatus as claimed in claim 1 , wherein a plurality of polishing platens are provided along the path, and the guide rail is arranged to allow the substrate carrier unit to pass through the plurality of polishing platens.
4. The chemical-mechanical polishing apparatus as claimed claim 3 , wherein the substrate carrier unit does not carry neither a driving source nor an electrical power source, and wherein an air pressure supply tube is connected to the substrate carrier unit during the substrate polishing process.
5. The chemical-mechanical polishing apparatus as claimed in claim 3 , wherein the path is a circulatory path.
6. The chemical-mechanical polishing apparatus as claimed claim 5 , wherein the substrate carrier unit does not carry neither a driving source nor an electrical power source, and wherein an air pressure supply tube is connected to the substrate carrier unit during the substrate polishing process.
7. The chemical-mechanical polishing apparatus as claimed in claim 5 , wherein the guide rail is formed in a closed loop.
8. The chemical-mechanical polishing apparatus as claimed in claim 7 , wherein the substrate carrier unit does not carry neither a driving source nor an electrical power source, and wherein an air pressure supply tube is connected to the substrate carrier unit during the substrate polishing process.
9. The chemical-mechanical polishing apparatus as claimed in claim 1 , wherein the substrate carrier unit does not carry neither a driving source nor an electrical power source, and wherein an air pressure supply tube is connected to the substrate carrier unit during the substrate polishing process.