Method and system for handling substrates

1. A method for handling substrates in a lithography manufacturing process, comprising:

providing a substrate for imaging, wherein the substrate is positioned underneath a plurality of porous chucks;

applying pressured air towards the substrate through the plurality of porous chucks using a plurality of pressure sources;

applying suction force away from the substrate using a plurality of vacuums; and

holding the substrate in place by controlling the pressured air applied by the plurality of pressure sources and the suction force generated by the plurality of vacuums, wherein holding the substrate in place comprises: creating a plurality of optical paths, wherein each optical path includes an imaging unit that images a corresponding area of the substrate; detecting mechanical and optical variations in a subarea of the substrate corresponding to each optical path; and compensating for the mechanical and optical variations detected in each optical path.

2. The method of claim 1 , wherein

the substrate is a roll-to-roll flexible substrate, and wherein the plurality of porous chucks covers a portion of area of the substrate.

3. The method of claim 1 , wherein compensating for the mechanical and optical variations comprises:

modulating balance of the pressured air and the suction force to control distance of each optical path;

detecting focus of the subarea of the substrate corresponding to each optical path; and

adjusting focus for imaging the subarea of the substrate.

4. The method of claim 3 , wherein modulating balance of the pressured air and the suction force comprises:

controlling balance of local air pressure and suction force for each subarea of the substrate independently.

5. The method of claim 3 , wherein adjusting focus comprises:

adjusting focus of each subarea of the substrate with respect to its corresponding optical path independently.

6. The method of claim 5 , wherein adjusting focus comprises:

adjusting focus for static exposure of substrate; and

adjusting focus for dynamic exposure of substrate.

7. The method of claim 1 further comprises:

placing the plurality of pressure sources and the plurality of vacuums to provide local control of edges of the substrate; and

applying the suction force concentric to each of the optical paths.

8. The method of claim 1 further comprises:

modulating each of the plurality of porous chucks with corresponding acoustic signals;

sensing the acoustic signals on a handler of the substrate; and

monitoring separation of substrate from each of the plurality of porous chucks and the handler using the acoustic signals.

9. The method of claim 8 , wherein the acoustic signals are transmitted from the handler and received at the plurality of porous chucks.

10. A system for handling substrates in a lithography manufacturing process, comprising:

a plurality of porous chucks positioned above a substrate for imaging;

a plurality of pressure sources configured to apply pressured air towards the substrate through the plurality of porous chucks;

a plurality of vacuums configured to apply suction force away from the substrate;

a controller with control logic configured to hold the substrate in place by controlling the pressured air applied by the plurality of pressure sources and the suction force generated by the plurality of vacuums;

a plurality of optical paths, wherein each optical path includes an imaging unit that images a corresponding area of the substrate;

control logic configured to detect mechanical and optical variations in a subarea of the substrate corresponding to each optical path; and

control logic configured to compensate for the mechanical and optical variations detected in each optical path.

11. The system of claim 10 , wherein

the substrate is a roll-to-roll flexible substrate, and wherein the plurality of porous chucks covers a portion of area of the substrate.

12. The system of claim 10 , wherein control logic configured to compensate for the mechanical and optical variations comprises:

control logic configured to modulate balance of the pressured air and the suction force to control distance of each optical path;

control logic configured to detect focus of the subarea of the substrate corresponding to each optical path; and

control logic configured to adjust focus for imaging the subarea of the substrate.

13. The system of claim 12 , wherein control logic configured to modulate balance of the pressured air and the suction force comprises:

control logic configured to control balance of local air pressure and suction force for each subarea of the substrate independently.

14. The system of claim 12 , wherein control logic configured to adjust focus comprises:

control logic configured to adjust focus of each subarea of the substrate with respect to its corresponding optical path independently.

15. The system of claim 14 , wherein control logic configured to adjust focus of each subarea comprises:

control logic configured to adjust focus for static exposure of substrate; and

control logic configured to adjust focus for dynamic exposure of substrate.

16. The system of claim 10 further comprises:

control logic configured to place the plurality of pressure sources and the plurality of vacuums to provide local control of edges of the substrate; and

control logic configured to apply the suction force concentric to each of the optical paths.

17. The system of claim 10 further comprises:

control logic configured to modulate each of the plurality of porous chucks with corresponding acoustic signals;

control logic configured to sense the acoustic signals on a handler of the substrate; and

control logic configured to monitor separation of substrate from each of the plurality of porous chucks and the handler using the acoustic signals.

18. The system of claim 17 , wherein the acoustic signals are transmitted from the handler and received at the plurality of porous chucks.