MEMS device with impacting structure for enhanced resistance to stiction
View Patent ↗A microelectromechanical systems (MEMS) device ( 20 ) includes a substrate ( 24 ) and a movable element ( 22 ) adapted for motion relative to the substrate ( 24 ). A secondary structure ( 58 ) extends from the movable element ( 22 ). The secondary structure ( 58 ) includes a secondary mass ( 70 ) and a spring ( 68 ) interconnected between the movable element ( 22 ) and the mass ( 70 ). The spring ( 68 ) is sufficiently stiff to prevent movement of the mass ( 70 ) when the movable element ( 22 ) is subjected to force within a sensing range of the device ( 20 ). However, the spring ( 68 ) deflects when the device ( 20 ) is subjected to mechanical shock ( 86 ), and the spring ( 68 ) rebounds thus causing the mass ( 70 ) to impact the movable element ( 22 ) in a direction that would be likely to dislodge a potentially stuck movable element ( 22 ).
1. A microelectromechanical systems (MEMS) device comprising:
a substrate;
a movable element suspended above said substrate and adapted for motion relative to said substrate; and
a secondary structure coupled to said movable element and suspended above said substrate, said secondary structure being adapted to impact said movable element in response to said motion of said movable element.
2. A MEMS device as claimed in claim 1 wherein said secondary structure comprises:
a secondary mass; and
a spring element interconnected between said movable element and said secondary mass.
3. A MEMS device as claimed in claim 2 further comprising at least one spring member interconnected between said movable element and said substrate for enabling said motion of said movable element relative to said substrate, each of said at least one spring member being configured to undergo a first deflection amount in response to a unit of force, said spring element being configured to undergo a second deflection amount in response to said unit of force, said second deflection amount being less than said first deflection amount.
4. A MEMS device as claimed in claim 3 wherein a stiffness of said spring element is at least an order of magnitude greater than a collective stiffness of each of said at least one spring member such that said second deflection amount is less than said first deflection amount in response to said unit of force.
5. A MEMS device as claimed in claim 2 wherein a stiffness of said spring element substantially prevents movement of said secondary mass when said movable element is subjected to a force within a sensing range of said MEMS device.
6. A MEMS device as claimed in claim 2 wherein a stiffness of said spring element enables movement of said secondary mass into contact with said movable element when said movable element is subjected to a force that is greater than a sensing range of said MEMS device.
7. A MEMS device as claimed in claim 1 wherein said secondary structure comprises:
a spring element having a first end and a second end, said first end being coupled to said movable element; and
a secondary mass, said secondary mass including a stem coupled to said second end of said spring element and a cap coupled to said stem, said stem being oriented approximately perpendicular to a surface of said movable element, and said cap residing above said surface of said movable element such that a portion of said cap overlies said surface to yield a gap between said movable element and said cap of said secondary mass.
8. A MEMS device as claimed in claim 7 wherein:
said movable element is adapted for said motion about a rotational axis interposed between first and second ends of said movable element;
said movable element comprises a first section between said rotational axis and said first end of said movable element and a second section between said rotational axis and said second end of said movable element, said first section exhibits a first length between said rotational axis and said first end of said movable element, said second section exhibits a second length between said rotational axis and said second end of said movable element, said second length being greater than said first length, said spring element being coupled to said second section of said movable element; and
said spring element is configured to enable movement of said cap approximately perpendicular to said surface of said movable element in response to said motion about said rotational axis.
9. A MEMS device as claimed in claim 1 wherein said motion of said movable element is lateral motion, and said secondary structure comprises:
a spring element having a first end coupled to an outer side edge of said movable element; and
a secondary mass coupled to a second end of said spring element, said secondary mass being spaced apart from said movable element by a gap, said secondary mass being adapted to impact said outer side edge of said movable element in response to said lateral motion of said movable element.
10. A MEMS device as claimed in claim 1 wherein said movable element includes an aperture extending through a thickness of said movable element and said secondary structure resides in said aperture.
11. A MEMS device as claimed in claim 10 wherein said aperture is defined by inner side walls of said movable element and said secondary structure comprises:
a spring element positioned in said aperture, a first end of said spring element being coupled to one of said inner side walls of said movable element; and
a secondary mass positioned in said aperture and coupled to a second end of said spring element, said secondary mass being spaced apart from said movable element by a gap.
12. A MEMS device as claimed in claim 11 wherein said motion of said movable element is lateral motion, and said aperture is shaped such that one of said inner side walls forms an abutment edge, said secondary mass being adapted to impact said abutment edge in response to said lateral motion of said movable element.
13. A MEMS device as claimed in claim 1 further comprising at least one motion stop coupled to said substrate proximate to said movable element, wherein said movable element contacts said motion stop in response to a force greater than a sensing range of said MEMS device and said secondary structure is adapted to impact said movable element in response to said force to substantially prevent adhesion of said movable element to said motion stop.
14. A microelectromechanical systems (MEMS) device comprising:
a substrate;
a movable element suspended above said substrate and adapted for motion relative to said substrate; and
a secondary structure coupled to said movable element and suspended above said substrate, said secondary structure including a secondary mass and at least one spring element interconnected between said movable element and said secondary mass, said at least one spring element exhibits a stiffness, and said stiffness of said at least one spring element enables said secondary mass to impact said movable element when said movable element is subjected to a first force that is greater than a first acceleration sensing range of said MEMS device, and said stiffness of said at least one spring element substantially prevents movement of said secondary mass into contact with said movable element when said movable element is subjected to a second force within said first acceleration sensing range of said MEMS device, wherein said movable element moves relative to said substrate in response to said first and second forces.
15. A MEMS device as claimed in claim 14 wherein said secondary mass comprises:
a stem coupled to an end of said spring element and oriented approximately perpendicular to a surface of said movable element; and
a cap coupled to said stem and residing above said surface of said movable element such that a portion of said cap overlies said surface to yield a gap between said movable element and said cap of said secondary mass.
16. A MEMS device as claimed in claim 15 wherein:
said movable element is adapted for said motion about a rotational axis interposed between first and second ends of said movable element;
said movable element comprises a first section between said rotational axis and said first end and a second section between said rotational axis and said second end, said first section exhibits a first length between said rotational axis and said first end, said second section exhibits a second length between said rotational axis and said second end, said second length being greater than said first length, said spring element being coupled to said second section of said movable element; and
said spring element is configured to enable movement of said cap approximately perpendicular to said surface of said movable element when said movable element is subjected to said first force.
17. A MEMS device as claimed in claim 14 wherein:
an end of said spring element is coupled to an outer side edge of said movable element; and
said secondary mass is spaced apart from said movable element by a gap, said secondary mass being adapted to impact said outer side edge of said movable element when said movable element is subjected to said first force.
18. A MEMS device as claimed in claim 14 wherein:
said movable element includes an aperture extending through a thickness of said movable element, said aperture being defined by inner side walls of said movable element;
said spring element is positioned in said aperture, a first end of said spring element being coupled to one of said inner side walls of said movable element; and
said secondary mass is positioned in said aperture and coupled to a second end of said spring element, said secondary mass being spaced apart from said movable element by a gap, said aperture being shaped such that one of said inner side walls forms an abutment edge, and said secondary mass being adapted to impact said abutment edge when said movable element is subjected to said first force.
19. A microelectromechanical systems (MEMS) device comprising:
a substrate;
a movable element suspended above said substrate and adapted for motion relative to said substrate, said movable element including an aperture extending through a thickness of said movable element; and
a secondary structure coupled to said movable element and residing in said aperture, said secondary structure including a secondary mass and at least one spring element interconnected between said movable element and said secondary mass, said secondary mass being adapted to impact said movable element when said movable element is subjected to a force that is greater than a first acceleration sensing range of said MEMS device.
20. A MEMS device as claimed in claim 19 further comprising at least one spring member interconnected between said movable element and said substrate for enabling said motion of said movable element relative to said substrate, each of said at least one spring member being configured to undergo a first deflection amount in response to a unit of force, said at least one spring element being configured to undergo a second deflection amount in response to said unit of force, said second deflection amount being less than said first deflection amount.