Substrate processing apparatus
View Patent ↗A substrate processing apparatus comprising: a processing chamber which is to accommodate at least one substrate; a gas supply system which is to supply processing gas into the processing chamber; an exhaust system which is to exhaust atmosphere in the processing chamber; and at least one pair of electrodes which are to bring the processing gas into an active state and which are accommodated in protection tubes such that the electrodes can be inserted into and pulled out from the protection tubes, wherein the electrodes are accommodated in the protection tube in a state where at least a portion of the electrodes is bent, and the electrodes are formed of flexible members, is disclosed.
1. A substrate processing apparatus, comprising:
a processing chamber for accommodating a substrate;
a gas supply system for supplying processing gas into the processing chamber;
an exhaust system for exhausting atmosphere in the processing chamber;
at least one pair of electrodes for bringing the processing gas into an active state, the at least one pair of electrodes being formed of flexible members;
protection tubes for accommodating the electrodes such that the electrodes can be inserted into and pulled out from the protection tubes;
an inert gas supply system for supplying inert gas into the protection tubes; and
a controller, wherein
the electrodes are accommodated in the protection tubes in a state where at least a portion of each of the electrodes is bent, and
the controller controls the inert gas supply system such that the inert gas is supplied into the protection tubes.
2. The substrate processing apparatus of claim 1 , wherein each electrode includes a plurality of linear conducting members bundled together.
3. The substrate processing apparatus of claim 1 , wherein each electrode includes a plurality of linear conducting members weaved together and a core.
4. The substrate processing apparatus of claim 1 , wherein
the substrate processing apparatus is an apparatus wherein processing of the substrates are carried out in a state where a substrate holding member which holds a plurality of substrates in a multi-stacked manner at a predetermined distance from each other is accommodated in the processing chamber, and
the pair of electrodes are disposed along a stacking direction of the substrates, and ends of the electrodes are located at a position exceeding a position of a leading end substrate, which is held by the substrate holding member which is located on the side of the ends of the electrodes, by at least a length corresponding to the distance between adjacent substrates in the substrate holding member.
5. The substrate processing apparatus of claim 1 , wherein the pair of electrodes are accommodated in separate protection tubes, respectively, such that the electrodes can be inserted into and pulled out from the protection tubes, respectively.