IP Library Granted Patent US 8,198,643
Granted Patent B2
US 8,198,643 · App. 13/105,322 · Granted Jun 12, 2012

Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same

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Quick Facts
Patent No.
US 8,198,643
App. No.
13/105,322
Granted
Jun 12, 2012
Kind
B2
Abstract

The present invention relates to a light emitting element with arrayed cells, a method of manufacturing the same, and a light emitting device using the same. The present invention provides a light emitting element including a light emitting cell block with a plurality of light emitting cells connected in series or parallel on a single substrate, and a method of manufacturing the same, wherein each of the plurality of light emitting cells includes an N-type semiconductor layer and a P-type semiconductor layer, and the N-type semiconductor layer of one light emitting cell is electrically connected to the P-type semiconductor layer of another adjacent light emitting cell. Further, the present invention provides a light emitting device including a light emitting element with a plurality of light emitting cells connected in series. Accordingly, it is possible to simplify a manufacturing process of a light emitting device for illumination capable of being used with a household AC power source, to decrease a fraction defective occurring in manufacturing a light emitting device for illumination, and to mass-produce the light emitting device for illumination. Further, there is an advantage in that DC driving efficiency can be enhanced in an AC operation by installing a predetermined rectifying circuit outside the light emitting element.

Claims (37)

1. A light emitting diode, comprising:

a substrate;

a plurality of light emitting cells arranged on the substrate, each light emitting cell comprising a lower semiconductor layer on the substrate, an active layer on the lower semiconductor layer, and an upper semiconductor layer on the active layer, the plurality of light emitting cells being free of a parent substrate;

an upper electrode arranged on each light emitting cell; and

a lower electrode arranged between the substrate and the lower semiconductor layer of each light emitting cell,

wherein the lower electrode arranged under one of the plurality of light emitting cells is coupled to the upper electrode arranged on another one of the plurality of light emitting cells adjacent to the one of the plurality of light emitting cells.

2. The light emitting diode of claim 1 , further comprising an insulation layer arranged between the substrate and the lower electrode, the substrate comprising an electrically conductive substrate.

3. The light emitting diode of claim 1 , further comprising an insulation layer arranged on a side surface of each light emitting cell.

4. The light emitting diode of claim 1 , wherein a portion of the lower electrode is exposed in each light emitting cell.

5. The light emitting diode of claim 1 , wherein the lower electrode is coupled to the upper electrode arranged on one of the plurality of light emitting cells adjacent to the one of the plurality of light emitting cells using an air-bridge process or a step coverage process.

6. The light emitting diode of claim 1 , wherein a group of the plurality of light emitting cells is configured to emit light in response to application of a forward bias cycle of an alternating current (AC) power, and

wherein another group of the plurality of light emitting cells is configured to emit light in response to application of a reverse bias cycle of the AC power.

7. The light emitting diode of claim 6 , wherein at least one light emitting cell of the group of the plurality of light emitting cells configured to emit light in response to application of the forward bias cycle of the AC power is also configured to emit light in response to application of the reverse bias cycle of the AC power.

8. A light emitting diode, comprising:

a substrate;

a plurality of light emitting cells arranged on the substrate, each light emitting cell comprising a lower semiconductor layer on the substrate, an active layer on the lower semiconductor layer, and an upper semiconductor layer on the active layer, the plurality of light emitting cells being free of a parent substrate;

an upper electrode arranged on each light emitting cell; and

a lower electrode arranged between the substrate and the lower semiconductor layer of each light emitting cell,

wherein the lower electrode arranged under one of the plurality of light emitting cells is coupled to the upper electrode of each of two light emitting cells adjacent to the one of the plurality of light emitting cells.

9. The light emitting diode of claim 8 , wherein the upper electrode arranged on one light emitting cell is coupled to the lower electrode arranged under each of two adjacent light emitting cells.

10. The light emitting diode of claim 8 , further comprising an insulation layer arranged between the substrate and the lower electrode, the substrate comprising an electrically conductive substrate.

11. The light emitting diode of claim 8 , further comprising an insulation layer arranged on a side surface of each light emitting cell.

12. The light emitting diode of claim 8 , wherein a portion of the lower electrode is exposed in each light emitting cell.

13. The light emitting diode of claim 8 , wherein the lower electrode is coupled to the upper electrode arranged on one of the plurality of light emitting cells adjacent to the one of the plurality of light emitting cells using an air-bridge process or a step coverage process.

14. A light emitting diode, comprising:

a substrate;

a plurality of light emitting cells arranged on the substrate, each light emitting cell comprising a lower semiconductor layer on the substrate, an active layer on the lower semiconductor layer, and an upper semiconductor layer on the active layer, the plurality of light emitting cells being free of a parent substrate;

an upper electrode arranged on each light emitting cell;

a lower electrode arranged between the substrate and the lower semiconductor layer of each light emitting cell; and

a light emitting cell block comprising at least one light emitting cell of the plurality of light emitting cells,

wherein the light emitting cell block is configured to emit light in response to application of a forward bias cycle of an alternating current (AC) power, and

wherein the lower electrode of an end portion of the light emitting cell block is coupled to the upper electrode of each of two light emitting cells adjacent to the end portion of the light emitting cell block.

15. The light emitting diode of claim 14 , wherein the upper electrode of another end portion of the light emitting cell block is coupled to the lower electrode of each of two light emitting cells adjacent to the another end portion of the light emitting cell block.

16. The light emitting diode of claim 14 , further comprising an insulation layer arranged between the substrate and the lower electrode, the substrate comprising an electrically conductive substrate.

17. The light emitting diode of claim 14 , further comprising an insulation layer arranged on a side surface of each light emitting cell.

18. The light emitting diode of claim 14 , wherein a portion of the lower electrode is exposed in each light emitting cell.

19. The light emitting diode of claim 14 , wherein the lower electrode is coupled to the upper electrode using an air-bridge process or a step coverage process.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2024
From: SEOUL VIOSYS CO., LTD.
To: FAIRLIGHT INNOVATIONS, LLC
Reel/Frame 069400/0945 →
CHANGE OF NAME Recorded Apr 21, 2014
From: SEOUL OPTO DEVICE CO., LTD
To: SEOUL VIOSYS CO., LTD
Reel/Frame 032723/0126 →