IP Library Granted Patent US 8,664,832
Granted Patent B2
US 8,664,832 · App. 13/106,644 · Granted Mar 4, 2014

Mechanical temperature compensation methods and devices

Inventor: Göran Cewers (Limhamn, SE)
Assignee: Mindray Medical Sweden AB
H01L41/053H02N2/009F03G7/06
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Quick Facts
Patent No.
US 8,664,832
App. No.
13/106,644
Granted
Mar 4, 2014
Kind
B2
Abstract

The disclosure pertains to a device and a method for compensating for heat expansion effects in solid materials, as well as a method for manufacturing the device.

Claims (16)

1. A mechanical temperature compensation element for use as a compensation element for heat expansion that occurs primarily in an axial direction and that is orthogonal to a radial direction, comprising:

a flat element having a first heat expansion coefficient;

a housing having a second heat expansion coefficient different from said first heat expansion coefficient;

a linkage device, inclined in relation to said flat element, which mechanically connects said flat element and said housing such that a diagonal of the linkage device extends from a first contact point to a second contact point, said first contact point being located farther in the axial direction from the housing than the second contact point; and

wherein, upon an increase in temperature, said flat element expands radially, forcing said linkage device to move radially and increasing the separation, in the axial direction, of the first and second contact points,

whereby said radial expansion by said flat element is converted to movement in the axial direction, which raises or lowers said housing depending on the temperature of the temperature compensation element.

2. The temperature compensation element according to claim 1 , wherein said housing is two opposed halves.

3. The temperature compensation element according to claim 1 , wherein said flat element is one of a circular shaped disc or a polygon.

4. The temperature compensation element according to claim 1 , wherein said housing is one of circular or polygon shaped.

5. The temperature compensation element according to claim 1 , wherein said linkage device comprises a washer having a rhomboidal cross-section.

6. The temperature compensation element according to claim 1 , wherein said linkage device comprises radial slits.

7. The temperature compensation element according to claim 1 , wherein said linkage device comprises separate segments having a rhomboidal cross-section.

8. The temperature compensation element according to claim 1 , wherein said heat extension coefficient of said flat element is higher than that of said housing.

9. The temperature compensation element according to claim 1 , wherein said heat extension coefficient of said flat element is lower than that of said housing.

10. The temperature compensation element according to claim 1 , wherein said flat element is made of zinc.

11. The temperature compensation element according to claim 1 , wherein said temperature compensation element is connected in series to a piezo element.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 19, 2015
From: MINDRAY MEDICAL SWEDEN AB
To: SHENZHEN MINDRAY BIO-MEDICAL ELECTRONICS CO., LTD.
Reel/Frame 037094/0083 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2011
From: CEWERS, GORAN
To: MINDRAY MEDICAL SWEDEN AB
Reel/Frame 026285/0285 →
Continuity (2)
Provisional Application 61345756 · May 18, 2010
Related Publication 20110285246A1 · Nov 24, 2011