Step and repeat imprint lithography process
View Patent ↗The present invention is directed to methods for patterning a substrate by imprint lithography. Imprint lithography is a process in which a liquid is dispensed onto a substrate. A template is brought into contact with the liquid and the liquid is cured. The cured liquid includes an imprint of any patterns formed in the template. In one embodiment, the imprint process is designed to imprint only a portion of the substrate. The remainder of the substrate is imprinted by moving the template to a different portion of the template and repeating the imprint lithography process.
1. A method of patterning a substrate, said method comprising:
dispensing a volume of drops of liquid in a pattern on said substrate;
contacting said liquid with a patterned imprint lithography template;
applying a force to the template to initiate spread of said liquid;
defining a gap between said imprint lithography template and at least a region of said substrate, with said gap enabling positioning of said liquid by capillary forces to generate a continuous layer of said liquid over said region;
curing the liquid to form a patterned layer on the substrate;
separating the template from the cured liquid; and
transferring the formed patterned layer to the substrate to form a patterned substrate.
2. The method of claim 1 wherein the patterned substrate is a semiconductor wafer.
3. The method of claim 1 wherein the patterned substrate is patterned magnetic media for data storage.
4. The method of claim 1 wherein the patterned substrate is formed into a microelectronic device.
5. The method of claim 1 wherein the patterned substrate is formed into a microoptical device.
6. The method of claim 1 wherein the patterned substrate is formed into an opto-electronic device.
7. The method of claim 1 wherein the patterned substrates is formed into a micro-electronic mechanical system (MEMS).
8. A method of patterning a substrate, said method comprising:
dispensing a volume of drops of liquid in a pattern on said substrate;
contacting said liquid with a patterned imprint lithography template;
applying a force to the template to initiate spread of said liquid;
defining a gap between said imprint lithography template and a region of said substrate having a perimeter associated therewith, with said gap enabling positioning of said liquid by capillary forces to generate a continuous layer of said liquid over said region while being maintained within said perimeter;
curing the liquid to form a patterned layer on the substrate;
separating the template from the cured liquid; and
transferring the formed patterned layer to the substrate to form a patterned substrate.
9. The method of claim 1 wherein the patterned substrate is a semiconductor wafer.
10. The method of claim 1 wherein the patterned substrate is patterned magnetic media for data storage.
11. The method of claim 1 wherein the patterned substrate is formed into a microelectronic device.
12. The method of claim 1 wherein the patterned substrate is formed into a microoptical device.
13. The method of claim 1 wherein the patterned substrate is formed into an opto-electronic device.